18387116. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
Contents
DISPLAY DEVICE
Organization Name
Inventor(s)
KYONG TAE Park of Suwon-si (KR)
CHUL-HWAN Park of Asan-si (KR)
SUN-KYO Jung of Cheonan-si (KR)
DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18387116 titled 'DISPLAY DEVICE
Simplified Explanation
The patent application describes a display device with a crack detection circuit for detecting cracks in the display area.
- The display device includes a substrate, a display area with pixels and data lines, a peripheral area, a pad portion, an encapsulation layer, a crack detection circuit, and a first crack detection line.
- The first crack detection line is connected to the pad portion and the crack detection circuit, and is disposed on the encapsulation layer.
- Potential Applications:**
- Consumer electronics such as smartphones, tablets, and laptops.
- Industrial displays for control panels and monitoring systems.
- Automotive displays for infotainment systems and instrument clusters.
- Problems Solved:**
- Early detection of cracks in the display area can prevent further damage and improve overall device reliability.
- Allows for timely repairs or replacements to be made, reducing downtime for users.
- Benefits:**
- Improved durability and longevity of display devices.
- Enhanced user experience by ensuring uninterrupted display functionality.
- Cost-effective maintenance through early detection of display damage.
Original Abstract Submitted
A display device includes a substrate, a display area disposed on the substrate and including a plurality of pixels and data lines, a peripheral area disposed outside the display area of the substrate, a pad portion disposed in the peripheral area, an encapsulation layer disposed in the peripheral area and the display area, and disposed on the plurality of pixels of the display area, a crack detection circuit disposed in the peripheral area, and a first crack detection line connected with the pad portion and the crack detection circuit. The first crack detection line is disposed on the encapsulation layer.