18380404. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Chulyong Jang of Anyang-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380404 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor chip described in the patent application includes a semiconductor substrate with a first surface and a second surface. An active layer is located adjacent to the first surface of the substrate. A through electrode extends vertically in the substrate, with its lower surface connected to the active layer and its upper surface positioned lower than the second surface of the substrate. A passivation layer is placed on the second surface of the substrate, and a bonding pad is arranged on a portion of the passivation layer and the upper surface of the through electrode. The bonding pad has a "T" shape in the vertical direction and is connected to the through electrode.
- The semiconductor chip has a through electrode that extends vertically in the substrate, allowing for efficient electrical connections.
- The bonding pad has a unique "T" shape in the vertical direction, providing a secure and reliable connection to the through electrode.
- The passivation layer protects the second surface of the substrate and ensures the integrity of the chip.
- The active layer adjacent to the first surface of the substrate enables the chip to perform its intended functions.
Potential Applications
- This semiconductor chip design can be used in various electronic devices, such as smartphones, tablets, and computers.
- It can be applied in power electronics, integrated circuits, and other semiconductor-based technologies.
Problems Solved
- The through electrode allows for efficient vertical electrical connections within the chip, solving the problem of limited space for interconnections.
- The unique "T" shape of the bonding pad provides a secure and reliable connection, addressing the issue of potential disconnections or weak connections.
- The passivation layer protects the substrate, preventing damage and ensuring the longevity of the chip.
Benefits
- Improved electrical connectivity within the chip leads to enhanced performance and functionality of electronic devices.
- The secure and reliable connection provided by the bonding pad increases the overall reliability and durability of the chip.
- The passivation layer protects the chip from external factors, increasing its lifespan and reducing the risk of failure.
Original Abstract Submitted
A semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface. An active layer is disposed in a portion of the semiconductor substrate adjacent to the first surface. A through electrode extends in the semiconductor substrate in a vertical direction. The through electrode has a lower surface connected to the active layer and an upper surface positioned at a level lower than a level of the second surface of the semiconductor substrate. A passivation layer is disposed on the second surface of the semiconductor substrate. A bonding pad is arranged on a portion of the passivation layer and the upper surface of the through electrode. The bonding pad has a cross-section with a “T” shape in the vertical direction. The bonding pad is connected to the through electrode.
