18377500. WAFER PROCESSING SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 WAFER PROCESSING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER PROCESSING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
WAFER PROCESSING SYSTEM
Organization Name
Inventor(s)
Sung-Wook Jung of Suwon-si (KR)
WAFER PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18377500 titled 'WAFER PROCESSING SYSTEM
Simplified Explanation
The patent application describes a wafer processing system with an optical apparatus that splits a laser beam into two beams with different states of linear polarization and delays one of the beams to create a time delay between pulses.
- The optical apparatus includes a beam splitter that separates a laser beam into two beams with different states of linear polarization.
- A beam delayer is used to delay one of the beams so that there is a time delay between pulses of the two beams.
Potential Applications
This technology could be used in:
- Semiconductor manufacturing for precise wafer processing.
- Laser cutting and engraving for improved accuracy and efficiency.
Problems Solved
This technology solves:
- The need for precise control over laser pulses in wafer processing.
- The challenge of achieving accurate time delays between laser pulses.
Benefits
The benefits of this technology include:
- Improved precision in wafer processing.
- Enhanced efficiency in laser cutting and engraving processes.
Potential Commercial Applications
Potential commercial applications of this technology include:
- Semiconductor fabrication facilities.
- Laser cutting and engraving businesses.
Possible Prior Art
One possible prior art for this technology could be:
- Systems using beam splitters and delay devices for laser applications in other industries.
Unanswered Questions
How does this technology compare to existing laser pulse control systems?
This article does not provide a direct comparison to existing laser pulse control systems in terms of performance, cost, or complexity.
What are the limitations of this technology in terms of scalability and integration with existing wafer processing equipment?
This article does not address the potential limitations of scaling up this technology for industrial applications or integrating it with existing wafer processing equipment.
Original Abstract Submitted
A wafer processing system includes an optical apparatus including a beam splitter configured to receive a laser beam and to split the laser beam into a first beam in a first state of linear polarization and a second beam in a second state of linear polarization; and a beam delayer configured to delay the second beam so that a pulse of the second beam has a delay time with respect to a pulse of the first beam.
