18376862. SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR MANUFACTURING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING APPARATUS
Organization Name
Inventor(s)
SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18376862 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS
Simplified Explanation
The semiconductor manufacturing apparatus described in the abstract includes a first structure with a hole, a second structure on top of the first structure with a space for a substrate and a lower plate with a hole, pins for insertion into the holes, a locking plate between the pins, and a coupling member to connect or disconnect the pins.
- The apparatus consists of a first structure with a hole, a second structure with a space for a substrate, and pins for securing the structures together.
- The pins have a specific diameter and length to fit into the corresponding holes in the structures.
- A locking plate is used to secure the pins in place, preventing them from coming loose.
- A coupling member allows for easy connection and disconnection of the pins, facilitating the assembly and disassembly of the apparatus.
Potential Applications
The technology described in this patent application could be used in various semiconductor manufacturing processes, such as wafer processing, deposition, and etching.
Problems Solved
This technology solves the problem of securely connecting and disconnecting different structures in a semiconductor manufacturing apparatus, ensuring stability and efficiency in the manufacturing process.
Benefits
The benefits of this technology include improved stability and precision in semiconductor manufacturing processes, ease of assembly and disassembly, and potentially increased productivity.
Potential Commercial Applications
The technology could be applied in the production of semiconductor devices, integrated circuits, and other electronic components, benefiting companies involved in semiconductor manufacturing.
Possible Prior Art
One possible prior art for this technology could be similar apparatus designs used in semiconductor manufacturing processes, but with different mechanisms for connecting and securing the structures.
Unanswered Questions
How does this technology compare to existing methods of securing structures in semiconductor manufacturing apparatus?
This article does not provide a direct comparison to existing methods of securing structures in semiconductor manufacturing apparatus. It would be helpful to know the specific advantages and disadvantages of this technology compared to traditional methods.
What are the potential limitations or challenges in implementing this technology in semiconductor manufacturing processes?
The article does not address any potential limitations or challenges in implementing this technology. It would be important to understand any constraints or difficulties that may arise when integrating this apparatus into existing manufacturing processes.
Original Abstract Submitted
A semiconductor manufacturing apparatus includes a first structure having a first hole, a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole, a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction, a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole, a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin, and a coupling member configured to couple the first pin to or separate the first pin from the second pin.
