18376512. SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD
Organization Name
Inventor(s)
Isamu Taoda of Nirasaki City (JP)
SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18376512 titled 'SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD
Simplified Explanation
The abstract describes a substrate transfer unit that transfers a substrate to a target transfer position using a transfer mechanism with two arms connected by a shaft. The unit includes an imager, an image processor, and a controller that performs feedback control of the drive mechanism based on image information obtained in real-time.
- Transfer mechanism with two arms connected by a shaft
- Imager for photographing the substrate
- Image processor for image-processing
- Controller for feedback control based on image information
- Real-time feedback control and correction based on image information
Potential Applications
The technology can be applied in semiconductor manufacturing, electronics assembly, and other industries where precise substrate transfer is required.
Problems Solved
1. Ensures accurate and reliable substrate transfer 2. Real-time feedback control improves efficiency and reduces errors
Benefits
1. Increased precision in substrate transfer 2. Real-time correction based on image information 3. Improved efficiency and productivity
Potential Commercial Applications
"Real-Time Feedback Control for Substrate Transfer Units in Semiconductor Manufacturing"
Possible Prior Art
Prior art may include similar systems used in manufacturing and robotics industries.
Unanswered Questions
1. How does the system handle variations in substrate size and shape? 2. What is the maximum transfer speed that can be achieved with this technology?
Original Abstract Submitted
A substrate transfer unit that transfers a substrate to a target transfer position includes a transfer mechanism having a portion where two arms are connected to each other by a shaft, an imager photographing the substrate, an image processor image-processing images, and a controller configured to perform feedback control of a drive mechanism such that when the substrate is transferred by a transfer mechanism, a shaft angle detected by a shaft angle detector reaches a target value, and perform correction of a feedback control based on image information obtained by image-processor. The transfer controller is further configured to perform the feedback control periodically, cause the imager and the image processor to perform the photographing and the image-processing in real time concurrently with the feedback control at least once for each feedback control, and perform the correction of the control operation whenever the feedback control is performed.
