18376028. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunsoo Chung of Suwon-si (KR)
Younglyong Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18376028 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract consists of multiple semiconductor structures bonded together, each including semiconductor layers with active surfaces and circuit devices.
- The first semiconductor structure has a first semiconductor layer with a first active surface and a first circuit device, along with a first bonding layer.
- The second semiconductor structure is on top of the first one and includes a second semiconductor layer with a second active surface, a second circuit device, a second frontside bonding layer, and a second backside bonding layer.
- The third semiconductor structure is on top of the second one and includes a third semiconductor layer with a third active surface, a third circuit device, and a third bonding layer.
- Potential Applications:**
- Advanced semiconductor packaging technology for high-performance electronic devices. - Integration of multiple circuit devices in a compact and efficient manner.
- Problems Solved:**
- Enhanced performance and functionality of semiconductor devices through multi-layer integration. - Improved thermal management and electrical connectivity in semiconductor packages.
- Benefits:**
- Increased processing power and efficiency in electronic devices. - Enhanced reliability and durability of semiconductor packages.
- Potential Commercial Applications of this Technology:**
- High-end consumer electronics. - Automotive electronics. - Aerospace and defense systems.
- Possible Prior Art:**
One possible prior art could be the development of multi-chip modules (MCMs) in the semiconductor industry, where multiple chips are integrated into a single package for improved performance and functionality.
- Unanswered Questions:**
1. How does the bonding process between the different semiconductor layers affect the overall performance and reliability of the package? 2. Are there any specific challenges or limitations in scaling up this technology for mass production in commercial applications?
Original Abstract Submitted
A semiconductor package includes a first semiconductor structure including a first semiconductor layer having a first active surface and a first circuit device thereon and a first inactive surface and first bonding layer; a second semiconductor structure on the first semiconductor structure and including a second semiconductor layer having a second active surface and second circuit device thereon and a second inactive surface, a second frontside bonding layer, and a second backside bonding layer on the second inactive surface; and a third semiconductor structure on the second semiconductor structure and including a third semiconductor layer having a third active surface including a third circuit device thereon and a third inactive surface, and a third bonding layer, wherein the first bonding layer is bonded to the second frontside bonding layer, and the third bonding layer is bonded to the second backside bonding layer.
