18374705. SYSTEM-ON-CHIP AND AN INTERCONNECT BUS INCLUDED IN THE SYSTEM ON CHIP simplified abstract (Samsung Electronics Co., Ltd.)

SYSTEM-ON-CHIP AND AN INTERCONNECT BUS INCLUDED IN THE SYSTEM ON CHIP

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

BYUNGTAK Lee of Jeju-si (KR)

Hee-Seong Lee of Siheung-si (KR)

Myungkyoon Yim of Seoul (KR)

SYSTEM-ON-CHIP AND AN INTERCONNECT BUS INCLUDED IN THE SYSTEM ON CHIP - A simplified explanation of the abstract

This abstract first appeared for US patent application 18374705 titled 'SYSTEM-ON-CHIP AND AN INTERCONNECT BUS INCLUDED IN THE SYSTEM ON CHIP

Simplified Explanation

The abstract describes a system-on-chip that includes multiple components with different safety levels. It also includes a safety function protection controller and an interconnect bus. The first master component sends access requests to the first and second slave components. The safety function protection controller provides attribute information corresponding to the safety levels of the components. The interconnect bus transfers the access requests based on the safety levels.

• The system-on-chip includes multiple components with different safety levels.
• The first master component sends access requests to the first and second slave components.
• The safety function protection controller provides attribute information corresponding to the safety levels of the components.
• The interconnect bus transfers the access requests based on the safety levels.

Potential applications of this technology:

• Safety-critical systems where different components require different safety levels.
• Automotive systems where certain components need higher safety levels than others.
• Industrial control systems where safety levels of components need to be managed.

Problems solved by this technology:

• Ensures that access requests are transferred based on the safety levels of the components.
• Provides a mechanism to control access to components based on their safety levels.
• Helps prevent unauthorized access to components with higher safety levels.

Benefits of this technology:

• Improved safety and security in systems-on-chip.
• Efficient management of access requests based on safety levels.
• Flexibility in designing systems with components of different safety levels.

Original Abstract Submitted

A system-on-chip including: a first slave having a first safety level; a second slave having a second safety level; a first master having a third safety level, the first master outputs a first access request for the first slave and a second access request for the second slave; a safety function protection controller that outputs first attribute information corresponding to the first safety level, second attribute information corresponding to the second safety level, and third attribute information corresponding to the third safety level; and an interconnect bus that receives the first, second and third attribute information, transfers the first access request to the first slave when it is determined that the third safety level is higher than or equal to the first safety level, and blocks the second access request when it is determined that the third safety level is lower than the second safety level.