18373709. INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME
Organization Name
Inventor(s)
INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18373709 titled 'INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE SAME
Simplified Explanation
The abstract describes an integrated circuit with a cell region and a peripheral region, including gate lines, patterns, vias, and wiring layers.
- The integrated circuit includes a cell region with multiple cells and a peripheral region with a control circuit.
- The cell region has first gate lines on a substrate, first patterns in a wiring layer, second patterns in a backside wiring layer, and first vias passing through the substrate.
- Each first via connects a first pattern to a second pattern.
Potential Applications
This technology could be applied in the development of advanced integrated circuits for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This technology helps in optimizing the layout and connectivity of components within an integrated circuit, improving overall performance and efficiency.
Benefits
The integrated circuit design described in the patent application allows for more compact and efficient circuit layouts, leading to enhanced functionality and performance in electronic devices.
Potential Commercial Applications
The technology could be utilized by semiconductor companies to create next-generation integrated circuits for consumer electronics, automotive systems, and industrial applications.
Possible Prior Art
One possible prior art could be the use of vias in integrated circuits to connect different layers of wiring, although the specific configuration described in the patent application may be novel.
What is the specific application of this technology in consumer electronics?
The specific application of this technology in consumer electronics could be in the development of faster and more energy-efficient mobile devices, such as smartphones and tablets.
How does this technology improve the overall performance of integrated circuits?
This technology improves the overall performance of integrated circuits by optimizing the layout and connectivity of components, reducing signal interference, and enhancing signal transmission efficiency.
Original Abstract Submitted
Provided is an integrated circuit including a cell region in which a plurality of cells are arranged, and a peripheral region in which a circuit configured to control the plurality of cells is arranged, wherein the cell region further includes a plurality of first gate lines over a substrate, a plurality of first patterns in a first wiring layer above the plurality of first gate lines, a plurality of second patterns extending in a first horizontal direction in a backside wiring layer under the substrate, and a plurality of first vias, each of the plurality of first vias passing through the substrate in a vertical direction, wherein each of the plurality of first vias includes a top surface connected to a respective one of the plurality of first patterns and a bottom surface connected to a respective one of the plurality of second patterns.
