18370905. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Youngwoo Kim of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18370905 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The semiconductor device described in the abstract includes a substrate with an isolation layer defining an active region, a word line extending in a first horizontal direction, a bit line extending in a second horizontal direction perpendicular to the first direction, and multiple first dummy word lines in a second area of the substrate.

  • The device has an isolation layer that separates the active region in the substrate.
  • The word line and bit line are oriented in different horizontal directions on the substrate.
  • The first dummy word lines are shorter in length compared to the word line.

Potential Applications

The technology described in this patent application could be applied in:

  • Memory devices
  • Logic circuits
  • Microprocessors

Problems Solved

This technology helps in:

  • Improving the efficiency of semiconductor devices
  • Reducing signal interference
  • Enhancing overall performance

Benefits

The benefits of this technology include:

  • Higher data transmission speeds
  • Lower power consumption
  • Increased reliability of semiconductor devices

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Consumer electronics
  • Telecommunications
  • Automotive industry

Possible Prior Art

One possible prior art for this technology could be the use of dummy word lines in semiconductor devices to improve signal integrity and reduce noise.

Unanswered Questions

How does this technology impact the cost of semiconductor devices?

The abstract does not provide information on the cost implications of implementing this technology. Further research or analysis is needed to determine the cost-effectiveness of this innovation.

What are the potential challenges in integrating this technology into existing semiconductor manufacturing processes?

The abstract does not address the challenges that may arise during the integration of this technology into current semiconductor manufacturing processes. Additional studies or experiments may be required to identify and overcome any obstacles in implementation.


Original Abstract Submitted

A semiconductor device includes a substrate, an isolation layer defining an active region in the substrate, a word line extending in a first horizontal direction in a first area of the substrate, a bit line extending in a second horizontal direction perpendicular to the first horizontal direction, on the substrate, and a plurality of first dummy word lines provided in a second area of the substrate adjacent in the second horizontal direction to a first end portion of the first area in the first horizontal direction, the plurality of first dummy word lines extending in the first horizontal direction, wherein a length of each of the plurality of first dummy word lines in the first horizontal direction is less than a length of the word line in the first horizontal direction.