18368515. SYSTEMS AND METHODS FOR DATA PLACEMENT FOR IN-MEMORY-COMPUTE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SYSTEMS AND METHODS FOR DATA PLACEMENT FOR IN-MEMORY-COMPUTE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Krishna T. Malladi of San Jose CA (US)

Wenqin Huangfu of San Jose CA (US)

SYSTEMS AND METHODS FOR DATA PLACEMENT FOR IN-MEMORY-COMPUTE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18368515 titled 'SYSTEMS AND METHODS FOR DATA PLACEMENT FOR IN-MEMORY-COMPUTE

Simplified Explanation

According to one embodiment, a memory module includes:

• A memory die with dynamic random access memory (DRAM) banks, each consisting of an array of DRAM cells arranged in pages.
• A row buffer to store values of one of the pages.
• An input/output (IO) module.
• An in-memory compute (IMC) module, which includes an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and compute an output based on the operands and one of a plurality of ALU operations.
• A result register to store the output of the ALU.
• A controller to:

 * Receive operands and an instruction from a host processor.
 * Determine a data layout based on the instruction.
 * Supply the operands to the DRAM banks according to the data layout.
 * Control the IMC module to perform one of the ALU operations on the operands based on the instruction.

Potential applications of this technology:

• High-performance computing systems.
• Artificial intelligence and machine learning applications.
• Data-intensive workloads such as big data analytics and database management.

Problems solved by this technology:

• Improved memory access and data processing efficiency.
• Reduction in data movement between memory and processor.
• Enhanced performance and throughput in memory-intensive tasks.

Benefits of this technology:

• Faster data processing and computation.
• Reduced power consumption and latency.
• Improved overall system performance and efficiency.

Original Abstract Submitted

According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.