18367742. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
Contents
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Shogo Fukui of Koshi City (JP)
Masami Yamashita of Koshi City (JP)
Tomofumi Emura of Koshi City (JP)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367742 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The substrate processing apparatus described in the patent application is designed to process a substrate using a processing fluid in a supercritical state. Here are some key points to note:
- The apparatus includes a processing container for accommodating the substrate.
- It has a supply line connecting the container to a fluid source that sends out the processing fluid in the supercritical state.
- A discharge line is used to release the processing fluid from the container.
- A control valve in the discharge line helps regulate the pressure in the container.
- A controller is responsible for adjusting the opening degree of the control valve to control the pressure during the circulation process.
Potential Applications: - Semiconductor manufacturing - Thin film deposition - Surface modification processes
Problems Solved: - Precise control of pressure during substrate processing - Efficient utilization of supercritical processing fluid
Benefits: - Improved processing quality - Enhanced process efficiency - Reduced processing time and costs
Potential Commercial Applications:
- Optimizing Substrate Processing with Supercritical Fluids
Possible Prior Art: There are existing substrate processing apparatuses that use supercritical fluids for various applications such as cleaning, extraction, and deposition processes. However, the specific design and control mechanisms described in this patent application may offer unique advantages in terms of pressure regulation and process efficiency.
Unanswered Questions:
- How does the controller determine the optimal pressure levels for different substrate processing applications?
The patent application mentions adjusting the control valve during pressure-lowering and pressure-raising steps, but it does not elaborate on the specific criteria or algorithms used for these adjustments.
- Are there any safety measures in place to prevent pressure-related accidents or malfunctions in the substrate processing apparatus?
While the patent application focuses on pressure control within the processing container, it does not mention any safety features or protocols to ensure the system's reliability and prevent potential hazards.
Original Abstract Submitted
A substrate processing apparatus of processing a substrate by using a processing fluid in a supercritical state, the substrate processing apparatus includes: a processing container in which the substrate is accommodated; a supply line connecting the processing container to a fluid source configured to send out the processing fluid in the supercritical state; a discharge line configured to discharge the processing fluid from the processing container; a control valve interposed in the discharge line; and a controller configured to control a pressure in the processing container by adjusting an opening degree of the control valve. In a circulation process in which the processing fluid is supplied to the processing container from the supply line, the controller is configured to adjust the opening degree of the control valve such that each of a pressure-lowering step and a pressure-raising step.
