18367683. IMAGE SENSOR AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sang-Hoon Kim of Seongnam-si (KR)

Kwan Hee Lee of Suwon-si (KR)

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18367683 titled 'IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The abstract describes an image sensor with improved performance and a method of fabricating it. Here are the key points:

  • The image sensor includes a sensor array region and a pad region.
  • The sensor array region is where the unit pixels are defined by a first isolation film in the first substrate.
  • The image sensor also includes a second substrate with a wiring structure between its third and fourth surfaces.
  • The wiring structure includes an interlayer insulating film and a wiring.
  • The pad region has a pad trench that exposes the wiring through the first substrate.
  • A bonding terminal is located in the pad trench and connected to the wiring.
  • The first substrate at the pad region has a second isolation film adjacent to the pad trench.
  • The widths of the first and second isolation films decrease from the second surface to the first surface of the first substrate.

Potential applications of this technology:

  • Image sensors in digital cameras, smartphones, and other electronic devices.
  • Surveillance systems and security cameras.
  • Medical imaging devices.
  • Industrial inspection and quality control systems.

Problems solved by this technology:

  • Improved performance of image sensors.
  • Enhanced image quality and resolution.
  • Reduction of noise and interference.
  • More efficient and reliable data transfer.

Benefits of this technology:

  • Higher sensitivity to light.
  • Increased pixel density.
  • Improved signal-to-noise ratio.
  • Enhanced overall image quality.
  • More compact and lightweight image sensors.


Original Abstract Submitted

An image sensor with improved performance, and a method of fabricating the same are provided. The image sensor includes a sensor array region and a pad region, which is disposed outside the sensor array region, the image sensor comprising a first substrate including a first surface, upon which light is incident, and a second surface, which is opposite to the first surface, a first isolation film in the first substrate at the sensor array region, the first isolation film defining a plurality of unit pixels, a second substrate including a third surface, which faces the second surface of the first substrate, and a fourth surface, which is opposite to the third surface, a wiring structure between the second and third surfaces, the wiring structure including an interlayer insulating film and a wiring in the interlayer insulating film, a pad trench in the pad region, the pad trench exposing the wiring through the first substrate, a bonding terminal in the pad trench, the bonding terminal being connected to the wiring, and a second isolation film in the first substrate at the pad region, the second isolation film being adjacent to the pad trench, wherein widths of each of the first and second isolation films decrease in a direction from the second surface to the first surface.

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