18367642. SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
Organization Name
Inventor(s)
Sangsick Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367642 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
Simplified Explanation
The semiconductor package described in the abstract includes a substrate with lower pads and bumps, as well as non-conductive films. Regions are defined based on the separation distance between the bumps, with a constant sum of the thicknesses of the non-conductive films.
- Lower pads and bumps attached to a substrate
- Non-conductive films on the substrate
- Regions defined based on bump separation distance
- Constant sum of non-conductive film thicknesses
Potential Applications
This technology could be applied in various semiconductor packaging applications, such as in integrated circuits, microprocessors, and memory devices.
Problems Solved
This technology helps in improving the reliability and performance of semiconductor packages by providing a structured layout for the bumps and ensuring consistent thickness of non-conductive films.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved thermal management, and increased overall durability of semiconductor packages.
Potential Commercial Applications
This technology could be utilized in the manufacturing of consumer electronics, automotive electronics, telecommunications equipment, and industrial machinery.
Possible Prior Art
One possible prior art could be the use of non-conductive films in semiconductor packaging to provide insulation and protection for the components. Another could be the arrangement of bumps on lower pads to facilitate electrical connections.
Unanswered Questions
How does the separation distance between bumps impact the performance of the semiconductor package?
The abstract mentions that regions are defined based on the separation distance between bumps, but it does not elaborate on how this affects the overall functionality of the semiconductor package.
Are there any specific materials recommended for the non-conductive films in this technology?
While the abstract mentions the presence of non-conductive films, it does not specify the materials used or any requirements for these films in the semiconductor package.
Original Abstract Submitted
According to embodiments of the present disclosure, a semiconductor package is provided. The semiconductor package includes a substrate including a first surface and a second surface opposite to the first surface; and a plurality of lower pads on the second surface at different intervals. The semiconductor package further includes: a plurality of bumps attached to the plurality of lower pads; a first non-conductive film on the second surface of the substrate; and a second non-conductive film on the first non-conductive film. A plurality of regions are defined in the semiconductor package according to a separation distance between the plurality of bumps, such that each region of the plurality of regions includes respective bumps, from among the plurality of bumps, that have a respective separation distance between neighboring ones of the respective bumps within the region. A sum of thicknesses of the first and second non-conductive films is constant.
