18367549. INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Minjae Jeong of Suwon-si (KR)

Jaehee Cho of Suwon-si (KR)

Geonwoo Nam of Suwon-si (KR)

Jungho Do of Suwon-si (KR)

Jisu Yu of Suwon-si (KR)

Hyeongyu You of Suwon-si (KR)

Seungyoung Lee of Suwon-si (KR)

INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18367549 titled 'INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The abstract describes an integrated circuit with a standard cell that includes a metal layer with patterns and tracks, including cell tracks and a power distribution network (PDN) track.

• Metal layer with patterns and tracks:

 * Patterns extend in a first horizontal direction.
 * Tracks are spaced apart in a second horizontal direction.
 * Cell patterns are formed on cell tracks.
 * PDN pattern or routing pattern is formed on the PDN track.

• Cell patterns and PDN patterns:

 * First pattern is on a cell track, spaced apart from cell boundary by a first length.
 * Second pattern is on another cell track, spaced apart from cell boundary by a second length.

• Potential Applications:

 * Semiconductor industry for integrated circuits.
 * Electronics manufacturing for improved circuit design.

• Problems Solved:

 * Efficient power distribution within the integrated circuit.
 * Optimal layout of cell patterns and power distribution patterns.

• Benefits:

 * Enhanced performance and reliability of the integrated circuit.
 * Simplified design process for circuit layout.

• Potential Commercial Applications:

 * Semiconductor companies for developing advanced integrated circuits.
 * Electronics manufacturers for incorporating innovative designs.

• Possible Prior Art:

 * Previous patents related to standard cell design and power distribution networks.

1. 1. 1. Unanswered Questions:
         1. How does this integrated circuit improve power efficiency compared to traditional designs?

The abstract mentions a power distribution network track, but it does not elaborate on the specific mechanisms or technologies used to enhance power efficiency within the circuit.

1. 1. 1. 1. What are the potential challenges in implementing this integrated circuit design in mass production?

While the abstract highlights the benefits of the proposed design, it does not address any potential obstacles or limitations that may arise during the manufacturing process.

Original Abstract Submitted

An integrated circuit including a standard cell including: a metal layer including a pattern extending in a first horizontal direction and a plurality of tracks spaced apart from one another in a second horizontal direction, wherein the plurality of tracks include a plurality of cell tracks and one power distribution network (PDN) track, wherein cell patterns are formed on the plurality of cell tracks, and a PDN pattern or a routing pattern is formed on the one power distribution network (PDN) track, wherein a first pattern is spaced apart from a cell boundary of the standard cell by a first length and is formed on a first cell track among the plurality of cell tracks, and wherein a second pattern is spaced apart from a cell boundary of the standard cell by a second length and is formed on a second cell track among the plurality of cell tracks.