18367183. INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367183 titled 'INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The integrated circuit (IC) device described in the abstract includes various components such as word lines, conductive expanded pads, pad isolation structures, direct contacts, bit lines, conductive plugs, and separation fences. Here is a simplified explanation of the patent application abstract:
- Substrate with active regions
- Word lines in a horizontal direction across active regions
- Conductive expanded pads connected to active regions
- Pad isolation structures between expanded pads
- Direct contacts connected to active regions
- Bit lines in a perpendicular horizontal direction on direct contacts and pad isolation structures
- Conductive plugs on expanded pads
- Separation fences passing through expanded pads and plugs
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- Potential Applications of this Technology
- Memory devices - Microprocessors - Integrated circuits
- Problems Solved by this Technology
- Efficient data transfer - Improved connectivity - Enhanced performance
- Benefits of this Technology
- Higher data processing speeds - Enhanced reliability - Compact design
- Potential Commercial Applications of this Technology
- Advanced Semiconductor Devices for Enhanced Performance
- Potential Commercial Applications of this Technology
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- Possible Prior Art
There may be prior art related to the integration of various components in an IC device, such as word lines, conductive pads, and isolation structures. Previous patents or publications in the field of semiconductor technology could provide insights into similar innovations.
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- Unanswered Questions
- How does this technology compare to existing IC devices in terms of performance and efficiency?
The article does not provide a direct comparison between this technology and existing IC devices. Further research or testing may be needed to evaluate its advantages over current solutions.
- What are the specific manufacturing processes involved in creating this integrated circuit device?
The article does not delve into the detailed manufacturing processes used to produce this IC device. Understanding the fabrication methods could provide valuable insights into its production feasibility and scalability.
Original Abstract Submitted
An integrated circuit (IC) device is provided. The IC device includes: a substrate having active regions; word lines extending in a first horizontal direction across the active regions; conductive expanded pads on the substrate and connected to the active regions; pad isolation structures located between the conductive expanded pads; direct contacts connected to the active regions; bit lines extending in a second horizontal direction perpendicular to the first horizontal direction, on the direct contacts and the pad isolation structures, and connected to the direct contacts; conductive plugs extending in a vertical direction on the conductive expanded pads and connected to the conductive expanded pads; and separation fences passing through the conductive expanded pads and the conductive plugs, and having sidewalls extending linearly in the vertical direction.
