18367108. BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFER COAT INSULATION simplified abstract (Skyworks Solutions, Inc.)
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFER COAT INSULATION
Organization Name
Inventor(s)
Atsushi Takano of Kadoma-Shi (JP)
Mitsuhiro Furukawa of Nishinomiya-Shi (JP)
Yusuke Horiguchi of Osaka-Shi (JP)
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFER COAT INSULATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367108 titled 'BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFER COAT INSULATION
Simplified Explanation
The electronic device package described in the abstract includes several key components:
- Electrical device on a base substrate
- Conductive column connecting the electrical device to the base substrate
- Cap substrate covering the electrical device and bonded to the conductive column
- Organic dielectric buffer coat material on the lower surface of the base substrate
- Through substrate via passing through the base substrate and the organic dielectric buffer coat material
- Redistribution layer on top of the organic dielectric buffer coat material
- Contact pad on the redistribution layer, horizontally displaced from the through substrate via
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- Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
- Problems Solved
This technology helps in improving the electrical communication and reliability of electronic devices by providing a secure and efficient connection between different components.
- Benefits
- Enhanced electrical communication - Improved reliability and durability of electronic devices - Compact design for space-saving in electronic devices
- Potential Commercial Applications
"Advanced Electronic Device Packaging Technology for Improved Performance"
- Possible Prior Art
There may be prior art related to electronic device packaging technologies that focus on improving electrical communication and reliability in electronic devices.
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- Unanswered Questions
- How does this technology impact the overall cost of electronic devices?
The abstract does not provide information on the cost implications of implementing this technology in electronic devices.
- Are there any specific industries or sectors that could benefit the most from this technology?
The abstract does not mention any specific industries or sectors that could potentially benefit the most from this electronic device packaging technology.
Original Abstract Submitted
An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of organic dielectric buffer coat material on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of organic dielectric buffer coat material, a redistribution layer disposed on the layer of organic dielectric buffer coat material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.
