18367072. ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT simplified abstract (Apple Inc.)

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ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT

Organization Name

Apple Inc.

Inventor(s)

Daniel R. Bloom of Cupertino CA (US)

Chelsea E. Wojeski of Sunnyvale CA (US)

Edward Siahaan of San Francisco CA (US)

Nathan Morris of Cupertino CA (US)

Ryan S. Haley of Sunnyvale CA (US)

Tian Shi Li of Cupertino CA (US)

Toni Ristoski of Cupertino CA (US)

ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18367072 titled 'ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT

Simplified Explanation

The abstract describes an electronic device component made of a thermoset composite material. This component can be a structural part of the device's housing and can also serve as the outer surface of the housing. Additionally, the component is designed to be transparent to radio-frequency signals.

  • The electronic device component is made of a thermoset composite material.
  • It can be used as a structural component of the device's housing.
  • The component defines the exterior surface of the housing.
  • It is transparent to radio-frequency signals.

Potential Applications

  • Electronic devices such as smartphones, tablets, laptops, etc.
  • Communication devices like routers, modems, and antennas.
  • Wearable technology such as smartwatches and fitness trackers.

Problems Solved

  • Provides a durable and strong housing component for electronic devices.
  • Allows for the transmission and reception of radio-frequency signals without interference.
  • Offers a transparent material option for the exterior surface of electronic device housings.

Benefits

  • Enhanced structural integrity and durability of electronic device housings.
  • Improved signal transmission and reception capabilities.
  • Aesthetically pleasing design with a transparent exterior surface.


Original Abstract Submitted

An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

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