18356308. RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Joonggeun Lee of Suwon-si (KR)

Daechul Jeong of Suwon-si (KR)

Jeongyeol Bae of Suwon-si (KR)

Jongsoo Lee of Suwon-si (KR)

Sangmin Yoo of Suwon-si (KR)

RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18356308 titled 'RF CHIP TO IMPROVE TRANSMIT CHANNEL FLATNESS

Simplified Explanation

The abstract describes a patent application for a radio-frequency (RF) chip that includes a mixer, an amplification stage with unit amplifiers, and a compensation capacitor bank. The compensation capacitor bank adjusts capacitance based on control signals to optimize performance.

  • The RF chip includes a mixer that mixes local oscillation and baseband signals to output an RF signal.
  • The amplification stage amplifies the RF signal using unit amplifiers controlled by a first control signal.
  • A compensation capacitor bank between the mixer and amplification stage adjusts capacitance based on a complementary second control signal.

Potential Applications

The technology described in this patent application could be used in various RF communication devices such as smartphones, Wi-Fi routers, and IoT devices.

Problems Solved

This technology helps optimize the performance of RF chips by adjusting capacitance based on control signals, leading to improved signal quality and efficiency.

Benefits

The benefits of this technology include enhanced signal processing, improved signal strength, and overall better performance of RF communication devices.

Potential Commercial Applications

Potential commercial applications of this technology include the telecommunications industry, consumer electronics manufacturers, and companies developing IoT devices.

Possible Prior Art

One possible prior art could be the use of compensation capacitor banks in RF circuits to optimize performance, although the specific configuration described in this patent application may be novel.

Unanswered Questions

How does this technology compare to existing RF chip designs in terms of power consumption and signal quality?

This article does not provide a direct comparison between this technology and existing RF chip designs in terms of power consumption and signal quality. Further research or testing would be needed to determine the specific advantages or disadvantages in these areas.

What are the potential challenges in implementing this technology on a large scale for mass production?

The article does not address the potential challenges in implementing this technology on a large scale for mass production. Factors such as cost, manufacturing complexity, and compatibility with existing production processes could be significant considerations that are not covered in the abstract.


Original Abstract Submitted

A radio-frequency (RF) chip includes a mixer configured to mix a local oscillation signal with a baseband signal to output an RF signal, an amplification stage configured to amplify the RF signal through a plurality of unit amplifiers operating in response to a first control signal, and a compensation capacitor bank provided between the mixer and the amplification stage. The compensation capacitor bank is configured to adjust a capacitance of the compensation capacitor bank based on a second control signal, the second control signal being complementary to the first control signal.