18355004. SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM
Organization Name
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SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18355004 titled 'SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM
Simplified Explanation
The semiconductor chip stack structure described in the patent application includes multiple memory chips and chiplets that are interconnected. Here is a simplified explanation of the abstract:
- The chip stack structure consists of a buffer chip, a first memory chip, a second memory chip, and a third memory chip.
- The first memory chip has multiple banks of memory, referred to as first banks, and is placed on top of the buffer chip.
- The second memory chip is placed on top of the first memory chip and also has multiple banks of memory, referred to as second banks.
- Between the first and second memory chips, there are first chiplets that perform calculations on the data stored in the first banks of the first memory chip.
- Similarly, there are second chiplets between the first and second memory chips that perform calculations on the data stored in the second banks of the second memory chip.
- The third memory chip, which is placed on top of the buffer chip, has multiple banks of memory, referred to as third banks.
- The third memory chip is electrically connected to both the first and second memory chips.
Potential applications of this technology:
- High-performance computing: The chip stack structure allows for efficient data processing and calculations, making it suitable for applications that require significant computational power, such as scientific simulations, artificial intelligence, and data analytics.
- Data centers: The chip stack structure can be used in data centers to enhance memory capacity and processing capabilities, enabling faster and more efficient data processing.
- Mobile devices: By improving the performance and efficiency of memory chips, this technology can benefit mobile devices, allowing for faster data access and improved multitasking capabilities.
Problems solved by this technology:
- Memory bandwidth limitations: The chip stack structure addresses the issue of limited memory bandwidth by utilizing multiple memory chips and chiplets, allowing for parallel processing and improved data transfer rates.
- Space constraints: By stacking multiple chips vertically, the chip stack structure optimizes space utilization, making it suitable for devices with limited physical space, such as smartphones and wearable devices.
Benefits of this technology:
- Improved performance: The chip stack structure enables faster data processing and calculations by distributing the workload across multiple memory chips and chiplets.
- Increased memory capacity: By stacking multiple memory chips, the chip stack structure provides a higher memory capacity, allowing for larger data sets to be processed.
- Space efficiency: The vertical stacking of chips optimizes space utilization, making it possible to incorporate more memory capacity in devices without significantly increasing their physical size.
Original Abstract Submitted
A semiconductor chip stack structure may include a buffer chip, a first memory chip on the buffer chip and including a plurality of first banks, a second memory chip on the first memory chip and including a plurality of second banks, first chiplets between the first memory chip and the second memory chip and configured to perform calculations on data stored in the plurality of first banks of the first memory chip, second chiplets between the first memory chip and the second memory chip and configured to perform calculations on data stored in the plurality of second banks of the second memory chip, and a third memory chip on the buffer chip. The third memory chip may include a plurality of third banks. The third memory chip may be electrically connected to the first memory chip and the second memory chip.
