18353669. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Hiroyuki Nakamura of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18353669 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device with a flexible insulating member on a heat dissipation surface to prevent resin burrs from generating in a sealing member. A power module is included in the device, with a conductive die bonding portion, a semiconductor element bonded to the die bonding portion, a sealing member sealing both components, and a flexible insulating member bonded to the die bonding portion.
- Prevent resin burrs from generating in a sealing member
- Semiconductor device with flexible insulating member on heat dissipation surface
- Power module with conductive die bonding portion and semiconductor element
- Flexible insulating member arranged in a recessed portion on lower surface of sealing member
- Convex portion protruding from lower surface of sealing member
Potential Applications
The technology described in the patent application could be applied in various semiconductor devices and power modules to improve insulation and prevent resin burrs from causing issues in sealing members.
Problems Solved
1. Resin burrs entering underneath the flexible insulating member 2. Ensuring proper sealing of the conductive die bonding portion and semiconductor element
Benefits
1. Enhanced insulation in semiconductor devices 2. Prevention of resin burrs from causing sealing issues 3. Improved reliability and performance of power modules
Potential Commercial Applications
The technology could be utilized in the manufacturing of power modules, semiconductor devices, and other electronic components where insulation and sealing are critical for performance and reliability.
Possible Prior Art
One possible prior art could be the use of rigid insulating materials in semiconductor devices, which may not provide the flexibility and prevention of resin burrs as described in the patent application.
Unanswered Questions
How does the flexible insulating member improve the overall performance of the power module?
The flexible insulating member helps prevent resin burrs from causing sealing issues, ensuring proper insulation and reliability in the power module.
Are there any specific materials recommended for the flexible insulating member in the patent application?
The patent application does not specify any particular materials for the flexible insulating member, leaving room for further research and development in this area.
Original Abstract Submitted
In a semiconductor device including a flexible insulating member on a heat dissipation surface, resin burrs entering underneath the flexible insulating member are prevented from generating in a sealing member. A power module includes a conductive die bonding portion, a semiconductor element bonded to an upper surface of the die bonding portion, a sealing member sealing the die bonding portion and the semiconductor element, and a flexible insulating member bonded to a lower surface of the die bonding portion. The flexible insulating member is arranged in a recessed portion on a lower surface of the sealing member and has a convex portion protruding from the lower surface of the sealing member.
