18351748. METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18351748 titled 'METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a method of manufacturing a semiconductor package. Here is a simplified explanation of the abstract:
- A wafer with semiconductor chips on one surface is prepared. - The opposite surface of the wafer is ground. - The ground surface is coated with a liquid adhesive material to form a thin uncured adhesive layer. - The uncured adhesive layer is semi-cured. - The wafer is cut to separate the semiconductor chips. - The semiconductor chips are stacked using the semi-cured adhesive layer. - The adhesive layer between the stacked chips is fully cured.
Potential applications of this technology:
- Manufacturing of semiconductor packages for electronic devices.
- Integration of multiple semiconductor chips in a compact and efficient manner.
Problems solved by this technology:
- Efficient separation and stacking of semiconductor chips.
- Ensuring proper adhesion between the chips during stacking.
Benefits of this technology:
- Improved manufacturing process for semiconductor packages.
- Enhanced reliability and performance of electronic devices.
- Cost-effective production of stacked semiconductor chips.
Original Abstract Submitted
A method of manufacturing a semiconductor package includes preparing a wafer having a first surface on which a plurality of semiconductor chips are disposed and a second surface, opposite to the first surface. The second surface of the wafer is ground. The ground second surface of the wafer is coated with a liquid adhesive material to form an uncured adhesive layer having a thickness of 5 μm or less. The uncured adhesive layer on the wafer is semi-cured. The wafer is cut so as to separate the plurality of semiconductor chips from one another. The plurality of semiconductor chips are stacked using the semi-cured adhesive layer. The semi-cured adhesive layer disposed between the plurality of stacked semiconductor chips is fully cured.
