18348233. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seong Ho Shin of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18348233 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with two surfaces, first and second. On the first surface, there are (1-1)-th substrate pads and (1-2)-th substrate pads. The (1-1)-th and (1-2)-th substrate pads have first connecting terminals. On the second surface, there are (2-1)-th substrate pads and (2-2)-th substrate pads, along with an interposer. The (2-1)-th and (2-2)-th substrate pads, as well as the interposer, have second connecting terminals. Finally, there is a first semiconductor chip mounted on the interposer.
Bullet points explaining the patent/innovation:
- The semiconductor package includes a substrate with two surfaces, on which various substrate pads and connecting terminals are placed.
- The first surface of the substrate has (1-1)-th and (1-2)-th substrate pads with first connecting terminals.
- The second surface of the substrate has (2-1)-th and (2-2)-th substrate pads, along with an interposer with second connecting terminals.
- A first semiconductor chip is mounted on the interposer.
- The (1-2)-th substrate pads have a smaller maximum width than the (1-1)-th substrate pads.
- The (2-2)-th substrate pads have a smaller maximum width than the (2-1)-th substrate pads.
- The (1-1)-th and (2-1)-th substrate pads transmit first signals, ground signals, or power signals.
- The (1-2)-th and (2-2)-th substrate pads transmit second signals that are faster than the first signals.
Potential applications of this technology:
- This semiconductor package design can be used in various electronic devices, such as smartphones, tablets, and computers.
- It can be applied in high-speed data transmission systems, where the faster second signals are crucial.
Problems solved by this technology:
- The design addresses the need for efficient signal transmission in semiconductor packages.
- It solves the problem of signal degradation and loss by separating slower and faster signals onto different substrate pads.
Benefits of this technology:
- Improved signal integrity and reduced signal degradation.
- Enhanced performance and reliability of electronic devices.
- Enables faster data transmission and communication between components.
Original Abstract Submitted
A semiconductor package includes a substrate having opposite first and second surfaces; (1-1)-th substrate pads and (1-2)-th substrate pads on the first surface of the substrate; first connecting terminals on the (1-1)-th substrate pads and the (1-2)-th substrate pads; (2-1)-th substrate pads and (2-2)-th substrate pads on the second surface of the substrate; an interposer on the second surface of the substrate; second connecting terminals between the (2-1)-th substrate pads, the (2-2)-th substrate pads, and the interposer; and a first semiconductor chip on the interposer. The (1-2)-th substrate pads have a smaller maximum width than the (1-1)-th substrate pads. The (2-2)-th substrate pads have a smaller maximum width than the (2-1)-th substrate pads. The (1-1)-th substrate pads and the (2-1)-th substrate pads transmit first signals, ground signals, or power signals. The (1-2)-th substrate pads and the (2-2)-th substrate pads transmit second signals that are faster than the first signals.
