18341921. INTEGRATED CIRCUIT DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
INTEGRATED CIRCUIT DEVICES
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18341921 titled 'INTEGRATED CIRCUIT DEVICES
Simplified Explanation
The patent application describes an integrated circuit device that consists of a substrate and multiple cell patterns with a pillar shape. These cell patterns are arranged in groups along horizontal directions. The first cell groups are arranged in a row along the second horizontal direction, while the second cell groups are spaced apart from the first cell groups and also arranged in a row along the second horizontal direction. The side surfaces of the second cell patterns have concave portions that are recessed inward along the side surfaces of the adjacent first cell patterns.
- The integrated circuit device has a substrate and multiple cell patterns with a pillar shape.
- The cell patterns are arranged in groups along horizontal directions.
- The first cell groups are arranged in a row along the second horizontal direction.
- The second cell groups are spaced apart from the first cell groups and also arranged in a row along the second horizontal direction.
- The side surfaces of the second cell patterns have concave portions that are recessed inward along the side surfaces of the adjacent first cell patterns.
Potential Applications:
- This technology can be used in the manufacturing of integrated circuits for various electronic devices such as smartphones, computers, and IoT devices.
- It can improve the performance and efficiency of integrated circuits by providing a unique cell pattern arrangement.
Problems Solved:
- The arrangement of cell patterns with concave portions helps to reduce interference and improve signal integrity in the integrated circuit device.
- The spacing between the first and second cell groups allows for better heat dissipation and prevents overheating issues.
Benefits:
- Improved signal integrity and reduced interference in the integrated circuit device.
- Enhanced heat dissipation capabilities, leading to better performance and reliability.
- Potential for smaller and more compact integrated circuits due to the unique cell pattern arrangement.
Original Abstract Submitted
An integrated circuit device includes a substrate and a plurality of cell patterns that have a pillar shape, wherein the plurality of cell patterns comprise a plurality of first cell groups that are arranged along a first horizontal direction and each comprise a plurality of first cell patterns arranged in a row along a second horizontal direction, and a plurality of second cell groups that are spaced apart from the plurality of first cell groups, are arranged along the first horizontal direction, and each comprise a plurality of second cell patterns arranged in a row along the second horizontal direction, and wherein respective side surfaces of the plurality of second cell patterns have respective concave portions that are recessed inward along respective side surfaces of the plurality of first cell patterns that are adjacent to respective ones of the plurality of second cell patterns.
