18341001. Three-Dimensional Shaping Stage And Three-Dimensional Shaping Apparatus simplified abstract (SEIKO EPSON CORPORATION)
Three-Dimensional Shaping Stage And Three-Dimensional Shaping Apparatus
Organization Name
Inventor(s)
Takafumi Sameshima of Matsumoto (JP)
Taki Hashimoto of Shiojiri (JP)
Three-Dimensional Shaping Stage And Three-Dimensional Shaping Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 18341001 titled 'Three-Dimensional Shaping Stage And Three-Dimensional Shaping Apparatus
Simplified Explanation
The patent application describes a three-dimensional shaping stage that is used for stacking shaping layers. The shaping stage includes a placement portion with an opening and a reference surface, a shaping stage with a shaping surface for stacking layers, a heating unit, a pressing unit, and a holding unit.
- The placement portion has an opening and a reference surface that can be adjusted for flatness.
- The shaping stage is placed on the reference surface and covers the opening. It has a shaping surface where shaping layers are stacked.
- The heating unit is located below the shaping stage and is used to heat the shaping stage.
- The pressing unit presses the heating unit against the shaping stage through the opening.
- The holding unit holds the shaping stage in place relative to the reference surface.
Potential Applications
- 3D printing and additive manufacturing processes.
- Manufacturing of complex shapes and structures.
- Prototyping and rapid product development.
Problems Solved
- Provides a stable and adjustable reference surface for accurate shaping.
- Allows for heating of the shaping stage to facilitate layer stacking.
- Ensures proper alignment and pressure during the shaping process.
Benefits
- Improved accuracy and precision in shaping layers.
- Enhanced control over the shaping process.
- Facilitates the production of complex and intricate designs.
Original Abstract Submitted
A three-dimensional shaping stage includes: a placement portion that includes an opening and a reference surface whose flatness is adjusted; a shaping stage that is placed at the reference surface so as to cover the opening and that includes a shaping surface at which shaping layers are stacked; a heating unit that is disposed below the shaping stage and that is configured to heat the shaping stage; a pressing unit configured to press the heating unit against the shaping stage via the opening; and a holding unit configured to relatively hold the shaping stage to the reference surface.
