18339550. RESONATOR DEVICE simplified abstract (SEIKO EPSON CORPORATION)
Contents
RESONATOR DEVICE
Organization Name
Inventor(s)
Yoko Kanemoto of Fujimi-machi (JP)
RESONATOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18339550 titled 'RESONATOR DEVICE
Simplified Explanation
The patent application describes a resonator device that includes a quartz crystal vibrating plate with a vibrating part and a frame part. The device also includes a first sealing member bonded to one surface side of the vibrating plate, a second sealing member bonded to the other surface side, and a bonding layer.
- The first and second sealing members can be films.
- The film is bonded to the frame part via the bonding layer.
- There is an area on the film's surface at the vibrating part side where the bonding layer does not exist.
Potential applications of this technology:
- Quartz crystal resonators used in electronic devices such as watches, clocks, and communication equipment.
- Frequency control devices in various electronic systems.
Problems solved by this technology:
- Provides improved sealing and protection for the quartz crystal vibrating plate.
- Enhances the stability and performance of the resonator device.
Benefits of this technology:
- Increased durability and reliability of the resonator device.
- Improved frequency control and accuracy.
- Simplified manufacturing process with the use of film sealing members.
Original Abstract Submitted
A resonator device includes a quartz crystal vibrating plate having a vibrating part and a frame part configured to surround the vibrating part in a plan view, a first sealing member bonded to one surface side of the quartz crystal vibrating plate, a second sealing member bonded to another surface side of the quartz crystal vibrating plate, and a bonding layer, wherein at least one of the first sealing member and the second sealing member is a film, and the film is bonded to the frame part via the bonding layer, and has an area where the bonding layer does not exist on a surface at the vibrating part side.
