18337180. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Seokcheon Baek of Suwon-si (KR)

INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18337180 titled 'INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Simplified Explanation

The abstract describes an integrated circuit device that consists of two stacked structures. The first structure includes a substrate, a peripheral circuit, and a bonding pad. The second structure includes a substrate with gate electrodes, a cell contact plug, a node separation structure, and a bonding pad.

  • The first structure of the integrated circuit device includes a substrate, peripheral circuit, and bonding pad.
  • The second structure is stacked on top of the first structure and includes a substrate with gate electrodes.
  • A cell contact plug is connected to the gate electrodes and is insulated from other gate electrodes.
  • A node separation structure surrounds the upper part of the cell contact plug.
  • A bonding pad is used to connect the first and second structures.

Potential Applications

  • This integrated circuit device can be used in various electronic devices, such as smartphones, computers, and IoT devices.
  • It can be utilized in the manufacturing of microprocessors, memory chips, and other integrated circuits.

Problems Solved

  • The integration of multiple structures in a compact and efficient manner is a challenge in the design and manufacturing of integrated circuits.
  • This technology solves the problem of connecting and insulating gate electrodes in a stacked structure.

Benefits

  • The stacked structure allows for a higher level of integration, enabling more complex and powerful integrated circuits.
  • The use of a cell contact plug and node separation structure improves the electrical performance and reliability of the device.
  • The bonding pads facilitate the connection between different structures, ensuring proper functionality of the integrated circuit.


Original Abstract Submitted

An integrated circuit device includes a first structure and a second structure stacked on the first structure. The first structure includes a first substrate, a peripheral circuit, and a first bonding pad. The second structure includes a second substrate that includes a first side and a second side, a plurality of gate electrodes disposed on the first side of the second substrate, a first cell contact plug that penetrates a first conductive pad of a first gate electrode, is electrically connected to the first gate electrode, penetrates second gate electrodes disposed above the first gate electrode, and is electrically insulated from the second gate electrodes, a first node separation structure that penetrates the second substrate and surrounds an upper part of the first cell contact plug positioned in the second substrate, and a second bonding pad bonded to the first bonding pad.

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