18336340. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)

From WikiPatents
Jump to navigation Jump to search

SEMICONDUCTOR DEVICES

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Eunsuk Hwang of Suwon-si (KR)

Sanghoon Uhm of Suwon-si (KR)

Minhee Cho of Suwon-si (KR)

SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18336340 titled 'SEMICONDUCTOR DEVICES

Simplified Explanation

The semiconductor device described in the patent application includes:

  • A bit line on a substrate
  • A gate electrode over the bit line and spaced apart from it
  • A gate insulation pattern on a sidewall of the gate electrode
  • A channel on a sidewall of the gate insulation pattern, made of an oxide semiconductor material
  • A conductive pattern contacting the upper surface of the channel, made of an amorphous oxide semiconductor material
  • A contact plug contacting the upper surface of the conductive pattern, which may include a metal

Potential applications of this technology:

  • Advanced semiconductor devices
  • High-performance electronics
  • Integrated circuits

Problems solved by this technology:

  • Improving performance and efficiency of semiconductor devices
  • Enhancing conductivity and reliability of electronic components

Benefits of this technology:

  • Increased speed and efficiency of electronic devices
  • Improved reliability and durability of semiconductor components
  • Enhanced performance of integrated circuits


Original Abstract Submitted

A semiconductor device may include a bit line on a substrate, a gate electrode over the bit line and spaced apart from the bit line, a gate insulation pattern on a sidewall of the gate electrode, a channel on a sidewall of the gate insulation pattern and including an oxide semiconductor material, a conductive pattern contacting an upper surface of the channel and including an amorphous oxide semiconductor material, and a contact plug contacting an upper surface of the conductive pattern. The contact plug may include a metal. The amorphous oxide semiconductor material may include fluorine (F), chlorine (Cl), nitrogen (N), hydrogen (H), or argon (Ar).