18325200. SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
Jeonghee Choi of Suwon-si (KR)
Bongcheol Kim of Suwon-si (KR)
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18325200 titled 'SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The abstract describes a substrate processing system that coats a photoresist film on a semiconductor substrate, exposes light onto the film to create a pattern, develops the pattern using wet and dry methods, cleans the edge of the film, and heats the film.
- Coating apparatus applies photoresist film on semiconductor substrate
- Exposure apparatus irradiates light to form a photoresist pattern region
- Developing system removes unnecessary region from film to form pattern
- Wet developing apparatus uses developing solution to remove unnecessary region
- Dry developing apparatus uses developing gas to remove unnecessary region
- Cleaning apparatus removes edge bead of film or pattern on edge region of substrate
- Heating apparatus heats the film or pattern
Potential Applications
The technology can be applied in semiconductor manufacturing processes, specifically in the production of integrated circuits and other electronic components.
Problems Solved
This technology helps in creating precise and accurate patterns on semiconductor substrates, which is crucial for the functionality and performance of electronic devices.
Benefits
The system streamlines the process of coating, exposing, developing, cleaning, and heating semiconductor substrates, leading to improved efficiency and accuracy in manufacturing.
Potential Commercial Applications
The technology can be utilized in the semiconductor industry for the mass production of electronic components, such as microchips and sensors.
Possible Prior Art
Prior art may include similar substrate processing systems used in semiconductor manufacturing, but specific details would need to be researched to identify any direct comparisons.
Unanswered Questions
How does this technology compare to traditional substrate processing methods?
This technology streamlines the substrate processing process by incorporating wet and dry developing methods, cleaning apparatus, and a heating apparatus. It would be interesting to know how this compares in terms of efficiency and cost-effectiveness.
What are the environmental impacts of using wet and dry developing methods in this technology?
The use of developing solutions and gases in the wet and dry developing apparatus may have environmental implications. It would be important to understand how these aspects are managed and if there are any potential environmental concerns associated with this technology.
Original Abstract Submitted
A substrate processing system includes a coating apparatus configured to coat a photoresist film on a semiconductor substrate, an exposure apparatus configured to irradiate light onto the photoresist film to form a photoresist pattern region, a developing system configured to remove an unnecessary region from the photoresist film except for the photoresist pattern region to form a photoresist pattern, the developing system including a wet developing apparatus and a dry developing apparatus, the wet developing apparatus configured to remove the unnecessary region using a developing solution, the dry developing apparatus configured to remove the unnecessary region using a developing gas, a cleaning apparatus including a cleaning chamber and configured to remove an edge bead of the photoresist film or the photoresist pattern on an edge region of the semiconductor substrate, and a heating apparatus configured to heat the photoresist film or the photoresist pattern.
