18321164. APPARATUS FOR HEATING WAFER simplified abstract (Samsung Electronics Co., Ltd.)
Contents
APPARATUS FOR HEATING WAFER
Organization Name
Inventor(s)
Junhyoun Park of Suwon-si (KR)
Junghwan Hwang of Suwon-si (KR)
APPARATUS FOR HEATING WAFER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18321164 titled 'APPARATUS FOR HEATING WAFER
Simplified Explanation
The apparatus for heating a wafer includes a heater, a heating block with a curved shape and a concave central portion, and support protrusions on the upper surface of the heating block that can be deformed in response to heating by the heater.
- Heater included in the apparatus
- Heating block with a curved shape and concave central portion
- Support protrusions on the upper surface of the heating block
- Support protrusions can be deformed in response to heating by the heater
Potential Applications
- Semiconductor manufacturing
- Wafer processing
- Thin film deposition
Problems Solved
- Uniform heating of wafers
- Preventing damage to wafers during heating process
- Ensuring consistent temperature distribution
Benefits
- Improved efficiency in wafer heating process
- Enhanced wafer quality and yield
- Reduced risk of wafer damage during heating
Original Abstract Submitted
An apparatus for heating a wafer includes a heater, a heating block on an upper surface of the heater, and a plurality of support protrusions protruding from an upper surface of the heating block, wherein the upper surface of the heating block has a curved shape with a concave central portion, and at least the support protrusion at the central portion of the heating block, among the plurality of support protrusions, is configured to be deformed in response to heating by the heater.
