18319601. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18319601 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes several components: an active region, a device isolation layer, a self-aligned pad layer, a bit line, and a contact structure.
- The active region is located between portions of the device isolation layer on a substrate.
- The self-aligned pad layer is situated on a first region of the active region and includes a pad protrusion that extends along an upper portion of a side surface of the first region.
- The bit line is electrically connected to a second region of the active region.
- The contact structure is on a side surface of the bit line and is electrically connected to the self-aligned pad layer.
- The side of the self-aligned pad layer is in contact with the device isolation layer.
Potential applications of this technology:
- Semiconductor devices: This innovation can be applied in the manufacturing of various semiconductor devices, such as integrated circuits and microprocessors.
- Memory devices: The described structure can be utilized in the production of memory devices, including dynamic random-access memory (DRAM) and flash memory.
Problems solved by this technology:
- Improved electrical connectivity: The self-aligned pad layer and contact structure provide enhanced electrical connections between the bit line and the active region, improving the overall performance of the semiconductor device.
- Efficient space utilization: The pad protrusion extending along the side surface of the active region allows for better space utilization within the device, optimizing the layout and potentially reducing the size of the semiconductor device.
Benefits of this technology:
- Enhanced device performance: The improved electrical connectivity ensures efficient signal transmission and reduces signal loss, leading to enhanced device performance.
- Space-saving design: The efficient space utilization achieved through the pad protrusion allows for more compact and smaller semiconductor devices, which can be advantageous in various applications where space is limited.
- Simplified manufacturing process: The self-aligned pad layer and contact structure provide a simplified and more streamlined manufacturing process for semiconductor devices, potentially reducing production costs and increasing efficiency.
Original Abstract Submitted
A semiconductor device includes an active region between portions of a device isolation layer on a substrate, a self-aligned pad layer on a first region of the active region, a bit line that is electrically connected to a second region of the active region, and a contact structure on a side surface of the bit line and electrically connected to the self-aligned pad layer. The self-aligned pad layer includes a pad protrusion that extends along an upper portion of a side surface of the first region of the active region, and a side of the self-aligned pad layer is in contact with the device isolation layer.
