18318042. PHOTOMASK INCLUDING LINE PATTERN MONITORING MARK AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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PHOTOMASK INCLUDING LINE PATTERN MONITORING MARK AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Byungje Jung of Suwon-si (KR)

PHOTOMASK INCLUDING LINE PATTERN MONITORING MARK AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18318042 titled 'PHOTOMASK INCLUDING LINE PATTERN MONITORING MARK AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME

Simplified Explanation

The patent application describes a photomask with line pattern monitoring marks for use in manufacturing integrated circuit devices.

  • The photomask includes unit blocks with three design line patterns offset in a second direction.
  • The unit blocks consist of a first unit block and a second unit block adjacent to each other.
  • The second unit block is offset from the first unit block by a rounding length in the second direction.
  • The monitoring line patterns are used to determine line end profile errors in the manufacturing process.

Potential Applications

  • Semiconductor manufacturing
  • Integrated circuit fabrication
  • Quality control in microelectronics production

Problems Solved

  • Monitoring line pattern accuracy
  • Improving line end profile precision
  • Enhancing integrated circuit device performance

Benefits

  • Increased manufacturing precision
  • Higher quality integrated circuit devices
  • Improved overall product reliability


Original Abstract Submitted

A photomask includes at least one line pattern monitoring mark having unit blocks that include design line patterns. Each of the unit blocks includes three design line patterns sequentially offset in a second direction perpendicular to the first direction, the unit blocks include a first unit block and a second unit block adjacent to the first unit block, the second unit block is offset from the first unit block by a rounding length in the second direction and is spaced apart from the first unit block in the first direction. In a method of manufacturing an integrated circuit device, monitoring line patterns are formed using the photomask, and a line end profile error in the monitoring line patterns is determined based on a cross-sectional structure of the monitoring line patterns taken along a line extending through at least a portion of the monitoring line patterns in the first direction.