18313491. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jimin Choi of Suwon-si (KR)

Joongwon Shin of Suwon-si (KR)

Sungyun Woo of Suwon-si (KR)

Yeonjin Lee of Suwon-si (KR)

Jongmin Lee of Suwon-si (KR)

Sehyun Hwang of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP - A simplified explanation of the abstract

This abstract first appeared for US patent application 18313491 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

Simplified Explanation

The semiconductor device described in the patent application includes multiple chip regions on a substrate, each surrounded by a scribe lane. These chip regions contain first align key patterns and first test element group patterns, while the scribe lane contains second align key patterns and second test element group patterns.

  • The semiconductor device has multiple chip regions on a substrate.
  • Each chip region is surrounded by a scribe lane.
  • The chip regions contain first align key patterns and first test element group patterns.
  • The scribe lane contains second align key patterns and second test element group patterns.

Potential Applications:

  • Semiconductor manufacturing: This technology can be used in the production of semiconductor devices, allowing for efficient testing and alignment processes.
  • Integrated circuits: The innovation can be applied in the development of integrated circuits, ensuring accurate alignment and testing of various elements within the circuits.

Problems Solved:

  • Alignment accuracy: The inclusion of align key patterns in both the chip regions and scribe lane helps ensure precise alignment during manufacturing processes.
  • Testing efficiency: The presence of test element group patterns in the chip regions and scribe lane allows for efficient testing of the semiconductor device.

Benefits:

  • Improved manufacturing process: The technology simplifies the alignment and testing processes, leading to increased efficiency and accuracy in semiconductor manufacturing.
  • Enhanced product quality: The precise alignment and efficient testing enabled by this innovation contribute to the production of high-quality semiconductor devices.


Original Abstract Submitted

A semiconductor device may include a plurality of chip regions on a substrate, at least one scribe lane surrounding each of the plurality of chip regions on the substrate, a plurality of first align key patterns and a plurality of first test element group patterns included in the plurality of chip regions, and a plurality of second align key patterns and a plurality of second test element group patterns included in the at least one scribe lane.