18308222. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Joonyoung Kwon of Suwon-si (KR)

Jiyoung Kim of Suwon-si (KR)

Junhyoung Kim of Suwon-si (KR)

Sukkang Sung of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18308222 titled 'SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Simplified Explanation

The semiconductor device described in the abstract includes a peripheral circuit structure, a cell array structure, and contact plugs for connecting circuits within the device.

  • The semiconductor device has a peripheral circuit structure with multiple circuit areas.
  • It also includes a cell array structure with memory cell blocks overlapping the peripheral circuit structure.
  • Contact plugs extend from the peripheral circuit connection area to connect internal circuits and external connection terminals.

Potential Applications

The technology described in this patent application could be applied in:

  • Memory devices
  • Integrated circuits
  • Semiconductor manufacturing

Problems Solved

This technology helps in:

  • Efficiently connecting circuits in a semiconductor device
  • Optimizing space utilization in the device

Benefits

The benefits of this technology include:

  • Improved performance of semiconductor devices
  • Enhanced reliability of circuit connections
  • Space-saving design for compact devices

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Consumer electronics
  • Automotive electronics
  • Telecommunications industry

Possible Prior Art

One possible prior art for this technology could be the use of contact plugs in semiconductor devices for circuit connections.

Unanswered Questions

How does this technology impact power consumption in semiconductor devices?

This article does not address the specific impact of this technology on power consumption in semiconductor devices. Further research or testing may be needed to determine the effects on power efficiency.

What are the potential challenges in implementing this technology on a large scale?

The article does not discuss the potential challenges that may arise when implementing this technology on a large scale, such as in mass production. Factors like cost, scalability, and manufacturing processes could be significant considerations.


Original Abstract Submitted

A semiconductor device includes a peripheral circuit structure including a plurality of circuit areas, a cell array structure including a pair of memory cell blocks overlapping the peripheral circuit structure in a first direction and spaced apart in a second direction, perpendicular to the first direction, with a peripheral circuit connection area therebetween, a first circuit area of the plurality of circuit areas that overlaps the peripheral circuit connection area in the first direction, and at least one contact plug extending in the first direction from the peripheral circuit connection area, and including a first end portion configured to connect to at least one circuit included in the first circuit area and facing the first circuit area and a second end portion configured to connect to an external connection terminal.