18303692. PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

From WikiPatents
Jump to navigation Jump to search

PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Fu-Hai Li of Tainan City (TW)

Yi Ching Ong of Hsinchu (TW)

Kuo-Ching Huang of Hsinchu City (TW)

PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18303692 titled 'PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME

Simplified Explanation

The embodiment phase change material (PCM) switch described in the abstract is a device that utilizes a phase change material to switch between conducting and insulating states in response to a heat pulse. Here are some key points to explain this innovation:

  • PCM element with first and second electrodes, heating element, and heat spreader
  • Phase change material switches between conducting and insulating phases
  • RF switch configuration blocks or conducts RF signals based on PCM state
  • Heat spreader electrically isolated from heating element and PCM element

Potential Applications

The technology could be used in RF switches, sensors, and other electronic devices that require rapid switching between conducting and insulating states.

Problems Solved

This technology solves the problem of achieving fast and reliable switching in electronic devices without the need for mechanical components.

Benefits

The benefits of this technology include improved efficiency, reduced energy consumption, and increased reliability in electronic systems.

Potential Commercial Applications

Potential commercial applications include telecommunications equipment, aerospace systems, and medical devices that require high-speed switching capabilities.

Possible Prior Art

One possible prior art for this technology could be the use of phase change materials in memory devices to store data by switching between different states.

Unanswered Questions

How does the heat pulse affect the phase change material to switch between conducting and insulating phases?

The heat pulse provided by the heating element triggers a change in the structure of the phase change material, causing it to transition between conducting and insulating states.

What materials are commonly used for the phase change material in similar devices?

Commonly used materials for phase change materials in similar devices include chalcogenide compounds, organic materials, and metallic alloys.


Original Abstract Submitted

An embodiment phase change material (PCM) switch may include a PCM element having a first electrode and a second electrode, a heating element coupled to a first side of the PCM element, and a heat spreader formed on a second side of the PCM element opposite to the heating element. The PCM element may include a phase change material that switches from an electrically conducting phase to an electrically insulating phase by application of a heat pulse provided by the heating element. The first electrode, the second electrode, the PCM element, and the heat spreader may be configured as an RF switch that blocks RF signals when the phase change material element is the electrically insulating phase and conducts RF signals when the when the phase change material element is in the electrically conducting phase. The heat spreader may be electrically isolated from the heating element and the PCM element.