18302466. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chien Hung Liu of Hsinchu County (TW)

Yu-Sheng Chen of Taoyuan City (TW)

Yi Ching Ong of Hsinchu (TW)

Hsien Jung Chen of Tainan City (TW)

Kuen-Yi Chen of Hsinchu City (TW)

Kuo-Ching Huang of Hsinchu City (TW)

Harry-HakLay Chuang of Zhubei City (TW)

Wei-Cheng Wu of Zhubei City (TW)

Yu-Jen Wang of Hsinchu City (TW)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18302466 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Simplified Explanation

The semiconductor die package described in the abstract integrates an inductor-capacitor (LC) semiconductor die with a logic semiconductor die, forming a voltage regulator circuit. The LC semiconductor die contains inductors and capacitors that are directly connected to transistors and other logic components on the logic semiconductor die.

• The integration of passive components (inductors and capacitors) into a single semiconductor die reduces signal propagation distances, potentially increasing operating efficiency and improving performance.
• This integration may also reduce the form factor of the semiconductor die package, as well as parasitic capacitance and inductance in the voltage regulator circuit.

Potential Applications

The technology described in the patent application could be applied in various electronic devices requiring efficient voltage regulation, such as smartphones, tablets, laptops, and other portable electronics.

Problems Solved

1. Signal propagation distances in voltage regulator circuits can be reduced, potentially improving efficiency and performance. 2. The integration of passive components into a single die can help reduce parasitic capacitance and inductance, which may enhance the overall performance of the voltage regulator circuit.

Benefits

1. Increased operating efficiency of the voltage regulator circuit. 2. Reduction in form factor of the semiconductor die package. 3. Improved performance of the voltage regulator circuit due to reduced parasitic capacitance and inductance.

Potential Commercial Applications

Optimizing voltage regulation in electronic devices, reducing form factor, and improving performance can be attractive features for manufacturers of consumer electronics, telecommunications equipment, and other devices requiring efficient power management.

Possible Prior Art

One possible prior art could be the integration of passive components into semiconductor dies for various applications, but the specific integration of an LC semiconductor die with a logic semiconductor die for voltage regulation purposes may be a novel approach.

Unanswered Questions

How does the integration of passive components into a single die impact the overall cost of manufacturing the semiconductor die package?

The abstract does not provide information on the cost implications of integrating passive components into a single die. Understanding the cost-effectiveness of this approach is crucial for assessing the commercial viability of the technology.

What are the potential challenges or limitations associated with integrating an LC semiconductor die with a logic semiconductor die?

While the abstract highlights the benefits of this integration, it does not address any potential challenges or limitations that may arise during the implementation of this technology. Identifying and addressing these issues is essential for successful adoption in real-world applications.

Original Abstract Submitted

A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.