18296336. WAFER CLEANING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
WAFER CLEANING EQUIPMENT
Organization Name
Inventor(s)
WAFER CLEANING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18296336 titled 'WAFER CLEANING EQUIPMENT
Simplified Explanation
The abstract describes a wafer cleaning equipment that consists of a vessel with inner walls and a bottom, as well as multiple nozzles and a support structure for holding a wafer. It also includes a megasonic cleaner with a rack and vibrator.
- The wafer cleaning equipment has a vessel with inner walls and a bottom.
- There are multiple first and second nozzles on the inner walls for cleaning.
- A support structure is present between the first and second nozzles to hold the wafer.
- A megasonic cleaner is included below the vessel's bottom, with a rack and vibrator.
Potential Applications:
- Semiconductor manufacturing: The wafer cleaning equipment can be used in the production of semiconductors to clean wafers before further processing.
- Electronics manufacturing: It can also be utilized in the manufacturing of electronic components to ensure cleanliness and quality.
Problems Solved:
- Contamination removal: The equipment effectively removes contaminants from the wafer's surface, ensuring a clean substrate for subsequent processing.
- Uniform cleaning: The arrangement of nozzles and support structure ensures uniform cleaning across the entire wafer surface.
Benefits:
- Efficient cleaning: The combination of multiple nozzles and a megasonic cleaner allows for efficient and thorough cleaning of wafers.
- Improved quality: By effectively removing contaminants, the equipment helps improve the quality and reliability of semiconductor and electronic components.
Original Abstract Submitted
A wafer cleaning equipment includes a vessel that includes a first inner wall, a second inner wall that faces the first inner wall, and a bottom connected to the first and second inner walls, a plurality of first nozzles disposed on the first inner wall, a plurality of second nozzles disposed on the second inner wall, a support structure disposed between the plurality of first nozzles and the plurality of second nozzles, where the support structure supports a wafer, and a megasonic cleaner disposed between the bottom of the vessel and the wafer supported by the support structure. The megasonic cleaner includes a rack and at least one vibrator disposed below the rack.
