18284386. RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
Contents
- 1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
Taichi Nakashima of Fukushima (JP)
Hiroyuki Fujisawa of Fukushima (JP)
Akira Otsuka of Fukushima (JP)
Koichi Isaji of Fukushima (JP)
Hajime Ogushi of Fukushima (JP)
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18284386 titled 'RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
Simplified Explanation
The patent application describes a resin composition containing a preliminary reaction product obtained by reacting a polyphenylene ether compound with an acid anhydride, along with a curable resin containing a reactive compound with an unsaturated double bond. The ratio of acid anhydride group to hydroxyl group is 1.5 or less, and the content of the curable resin is between 20 to 85 parts by mass per 100 parts by mass of the total composition.
- Acid anhydride and hydroxyl group reaction product
- Curable resin with unsaturated double bond
- Specific ratio and content requirements for the composition
Potential Applications
The resin composition could be used in various industries such as automotive, electronics, and construction for applications requiring high-performance materials with good mechanical properties and chemical resistance.
Problems Solved
- Improved adhesion between different materials - Enhanced durability and strength of composite materials
Benefits
- Increased bonding strength - Enhanced chemical resistance - Improved mechanical properties
Potential Commercial Applications
Optimized Resin Composition for High-Performance Materials
Possible Prior Art
There may be prior art related to resin compositions with similar components and properties, but specific details would need to be researched further.
Unanswered Questions
How does this resin composition compare to existing materials in terms of cost-effectiveness?
The cost-effectiveness of this resin composition compared to other materials in the market is not addressed in the patent application. Further analysis would be needed to determine the economic viability of using this composition.
What are the potential environmental impacts of using this resin composition compared to traditional materials?
The environmental impact of the resin composition, such as its recyclability and sustainability, is not discussed in the patent application. Additional research would be required to assess the eco-friendliness of this material.
Original Abstract Submitted
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).