18278944. VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED simplified abstract (Telefonaktiebolaget LM Ericsson (publ))

VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED

Organization Name

Telefonaktiebolaget LM Ericsson (publ)

Inventor(s)

Marthinus Da Silveira of Ottawa (CA)

Neil Mcgowan of Stittsville (CA)

VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED - A simplified explanation of the abstract

This abstract first appeared for US patent application 18278944 titled 'VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED

Simplified Explanation

The patent application describes a radio frequency feedline structure comprising multiple printed circuit boards (PCBs) with metal layers and vias connecting them to create an open channel for a suspended signal path.

• The first PCB has upper and lower metal layers with a cutout defining an upper portion of the open channel, connected by vias on opposite walls of the cutout.
• The second PCB has upper and lower metal layers with elongated slots defining a suspended signal path within the open channel, connected by vias.
• The third PCB has upper and lower metal layers with a cutout defining a lower portion of the open channel, connected by vias on opposite walls of the cutout.
• Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.

Potential Applications

This technology can be applied in:

• Telecommunications equipment
• Antenna systems
• Radar systems

Problems Solved

This technology addresses issues related to:

• Signal interference
• Signal loss
• Signal distortion

Benefits

The benefits of this technology include:

• Improved signal quality
• Enhanced signal transmission efficiency
• Reduced signal loss

Potential Commercial Applications

The potential commercial applications of this technology can be seen in:

• Telecommunications industry
• Aerospace industry
• Defense industry

Possible Prior Art

One possible prior art for this technology could be the use of traditional feedline structures in radio frequency systems.

How does this technology compare to existing feedline structures in terms of signal transmission efficiency?

This article does not provide a direct comparison with existing feedline structures in terms of signal transmission efficiency. Further research or testing may be needed to determine the performance differences between this technology and traditional feedline structures.

What are the potential cost implications of implementing this technology in existing systems?

The article does not discuss the potential cost implications of implementing this technology in existing systems. It would be beneficial to analyze the cost-effectiveness of adopting this technology compared to traditional feedline structures.

Original Abstract Submitted

Embodiments of a radio frequency feedline structure. A first printed circuit board (PCB) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. A second PCB includes upper and lower metal layers and elongated slots defining a suspended signal path within the open channel. The upper and lower metal layers are electrically connected by vias. A third PCB includes upper and lower metal layers and at least one cutout defining a lower portion of the open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.