18274229. PIEZOELECTRIC DEVICE AND PREPARATION METHOD THEREFOR, PANEL, AND TACTILE REPRODUCTION APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

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PIEZOELECTRIC DEVICE AND PREPARATION METHOD THEREFOR, PANEL, AND TACTILE REPRODUCTION APPARATUS

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Hui Hua of Beijing (CN)

Yuju Chen of Beijing (CN)

Xiaotong Liu of Beijing (CN)

Yongchun Tao of Beijing (CN)

PIEZOELECTRIC DEVICE AND PREPARATION METHOD THEREFOR, PANEL, AND TACTILE REPRODUCTION APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18274229 titled 'PIEZOELECTRIC DEVICE AND PREPARATION METHOD THEREFOR, PANEL, AND TACTILE REPRODUCTION APPARATUS

Simplified Explanation

The present disclosure describes a piezoelectric device with a specific structure and method of preparation, as well as a panel and tactile reproduction apparatus.

  • The piezoelectric device includes a substrate, bottom electrode layer, piezoelectric functional layer, top electrode layer, insulation layer, and wiring layer.
  • The insulation layer covers the edge portion of the top electrode layer, with a slope angle less than 60 degrees, and the wiring layer covers the top electrode layer and overlaps with the insulation layer.

Potential Applications

The piezoelectric device can be used in various applications such as touchscreens, haptic feedback devices, vibration sensors, and acoustic transducers.

Problems Solved

This technology solves the problem of providing a reliable and efficient piezoelectric device with a specific structure that enhances performance and durability.

Benefits

The benefits of this technology include improved sensitivity, accuracy, and response time in touchscreens and haptic feedback devices, as well as increased durability and longevity in various applications.

Potential Commercial Applications

Potential commercial applications of this technology include consumer electronics, automotive industry, medical devices, and industrial automation.

Possible Prior Art

One possible prior art for this technology could be the use of traditional piezoelectric devices with different structures and materials in similar applications.

Unanswered Questions

How does this piezoelectric device compare to other similar devices on the market in terms of performance and cost?

This article does not provide a direct comparison with other similar devices in the market. It would be helpful to have more information on the performance metrics and cost-effectiveness of this device compared to existing options.

What are the specific manufacturing processes involved in preparing this piezoelectric device, and are there any limitations or challenges in scaling up production?

The article briefly mentions the preparation method for the piezoelectric device but does not go into detail about the specific manufacturing processes involved. Understanding the manufacturing processes and any potential limitations or challenges in scaling up production would provide valuable insights into the feasibility of mass production.


Original Abstract Submitted

The present disclosure provides a piezoelectric device and a preparation method therefor, a panel, and a tactile reproduction apparatus. The piezoelectric device includes: a substrate; a bottom electrode layer disposed on the substrate; a piezoelectric functional layer disposed on the bottom electrode layer; a top electrode layer disposed on the piezoelectric functional layer; an insulation layer, arranged to cover an edge portion of the top electrode layer, the piezoelectric functional layer exposed from the top electrode layer and the bottom electrode layer exposed from the piezoelectric functional layer, an edge of the insulation layer has a slope angle less than 60 degrees; and a wiring layer disposed on the insulation layer, the wiring layer at least partially covers the top electrode layer exposed from the insulation layer, and the wiring layer covers the edge of the insulation layer in an overlapping area of the wiring layer and the insulation layer.