18259984. SEMICONDUCTOR LASER LIGHT SOURCE DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 SEMICONDUCTOR LASER LIGHT SOURCE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR LASER LIGHT SOURCE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR LASER LIGHT SOURCE DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR LASER LIGHT SOURCE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18259984 titled 'SEMICONDUCTOR LASER LIGHT SOURCE DEVICE
Simplified Explanation
The patent application describes a structure for a device with thermoelectric devices and a temperature control module conductor, with lead pins arranged on different sides of a dielectric substrate and conductive wires connecting various components.
- Lead pins arranged on principal surface and back surface of dielectric substrate
- Lower substrate with protruding portion for power supply to thermoelectric devices
- Temperature control module conductor provided from principal surface to upper side surface of dielectric substrate
- Conductive wires connecting temperature control module conductor and lead pins
Potential Applications
The technology described in the patent application could be applied in various temperature control systems, such as in electronic devices, automotive applications, and medical equipment.
Problems Solved
This technology solves the problem of efficiently controlling temperature in devices with thermoelectric devices, by providing a structure that allows for effective power supply and temperature regulation.
Benefits
The benefits of this technology include improved temperature control, increased efficiency in thermoelectric devices, and potentially longer lifespan of the devices due to optimized temperature management.
Potential Commercial Applications
A potential commercial application of this technology could be in the development of advanced cooling systems for electronic devices, which could improve performance and reliability.
Possible Prior Art
One possible prior art for this technology could be existing patents or research on thermoelectric devices and temperature control systems in electronic devices.
Unanswered Questions
How does this technology compare to existing temperature control systems in terms of efficiency and effectiveness?
This article does not provide a direct comparison with existing temperature control systems, so it is unclear how this technology stands out in terms of efficiency and effectiveness.
What are the potential limitations or challenges in implementing this technology in practical applications?
The article does not address any potential limitations or challenges that may arise in implementing this technology in real-world applications, leaving room for further exploration and analysis.
Original Abstract Submitted
The first and second lead pins (-) are arranged on the principal surface side of the dielectric substrate (). The third lead pin () is arranged on a back surface side of the dielectric substrate (). The lower substrate () has a protruding portion protruding above the upper substrate (). A metalized portion () for supplying power to the thermoelectric devices () is provided at the protruding portion. A temperature control module conductor () is provided from the principal surface to an upper side surface of the dielectric substrate (). The fourth conductive wire () includes a conductive wire () connecting the temperature control module conductor () provided on the upper side surface of the dielectric substrate () and the third lead pin (), and a conductive wire () connecting the temperature control module conductor () provided on the principal surface of the dielectric substrate and the metalized portion ().
