18252244. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Kazuhiro Nishimura of Fukuoka (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18252244 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a semiconductor device that allows for efficient screening in a short period of time. The device includes a switching element, a control circuit, a Zener diode, and two terminals. The switching element, control circuit, and Zener diode are all formed in the semiconductor substrate. The control circuit controls the switching element, and the Zener diode is connected to the power supply voltage line. One terminal serves as the anode of the Zener diode, while the other terminal is either the emitter or source of the switching element and is insulated from the first terminal within the semiconductor substrate.
- Semiconductor device for reliable screening in a short time
- Includes switching element, control circuit, Zener diode, and two terminals
- All components formed in semiconductor substrate
- Control circuit controls switching element
- Zener diode connected to power supply voltage line
- One terminal serves as anode of Zener diode
- Other terminal is either emitter or source of switching element and is insulated from first terminal
Potential Applications
- Electronics manufacturing
- Semiconductor testing and quality control
- Circuit design and development
Problems Solved
- Enables reliable screening in a short amount of time
- Improves efficiency of semiconductor testing
- Enhances overall quality control in electronics manufacturing
Benefits
- Faster screening process
- More reliable testing results
- Improved efficiency in semiconductor manufacturing
Original Abstract Submitted
Provided is a semiconductor device that enables reliable screening to be performed in a short amount of time. The semiconductor device includes a switching element, a control circuit, a Zener diode, a first terminal, and a second terminal. The switching element, the control circuit, and the Zener diode are formed in the semiconductor substrate. The control circuit controls the state of the switching element. The Zener diode includes a cathode connected to the power supply voltage line between the input terminal where the power supply voltage for driving the control circuit is inputted and the control circuit. The first terminal is provided on a main surface of the semiconductor substrate as an anode of the Zener diode. The second terminal is provided on the main surface as one of the emitter and the source of the switching element, and is insulated from the first terminal within the semiconductor substrate.
