18252032. METHOD FOR SELECTIVELY ETCHING A METAL COMPONENT simplified abstract (Microsoft Technology Licensing, LLC)
Contents
METHOD FOR SELECTIVELY ETCHING A METAL COMPONENT
Organization Name
Microsoft Technology Licensing, LLC
Inventor(s)
METHOD FOR SELECTIVELY ETCHING A METAL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18252032 titled 'METHOD FOR SELECTIVELY ETCHING A METAL COMPONENT
Simplified Explanation
The abstract describes a method for selectively etching a metal component of a workpiece using a hard mask and a basic etchant solution. The workpiece includes a semiconductor component with a specific material.
- The method involves forming a hard mask over the metal component of the workpiece.
- The metal component is then etched using a basic etchant solution, with the hard mask controlling the etching process.
- The workpiece includes a semiconductor component made of a material described by Formula 1.
Potential applications of this technology:
- Semiconductor manufacturing: This method can be used in the fabrication of semiconductor devices, where selective etching of metal components is often required.
- Microelectronics: The method can be applied in the production of microelectronic devices, such as integrated circuits, to selectively remove metal layers.
- MEMS fabrication: Microelectromechanical systems (MEMS) often involve metal components that need to be selectively etched, making this method useful in MEMS fabrication processes.
Problems solved by this technology:
- Selective etching: The method provides a controlled way to etch metal components while protecting other parts of the workpiece, allowing for precise fabrication processes.
- Compatibility with semiconductor materials: The use of a basic etchant solution and a hard mask ensures compatibility with semiconductor materials, preventing damage or unwanted reactions during the etching process.
Benefits of this technology:
- Precision: The method allows for precise control over the etching process, ensuring accurate removal of metal components without affecting other parts of the workpiece.
- Compatibility: The use of a basic etchant solution and a hard mask ensures compatibility with semiconductor materials, reducing the risk of damage or unwanted reactions.
- Efficiency: The method provides an efficient way to selectively etch metal components, saving time and resources in the fabrication process.
Original Abstract Submitted
A method for selectively etching a metal component of a workpiece comprises: forming a hard mask over the metal component; and etching the metal component using an etchant solution, whereby the hard mask controls the etching; wherein the etchant solution is a basic etchant solution; and wherein the workpiece includes a semiconductor component comprising a material of Formula 1:
