18249351. METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT simplified abstract (Robert Bosch GmbH)
METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT
Organization Name
Inventor(s)
Daniel Monteiro Diniz Reis of Esslingen Am Neckar (DE)
Frank Schatz of Kornwestheim (DE)
Mathias Mews of Reutlingen (DE)
Timo Schary of Aichtal-Neuenhaus (DE)
METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18249351 titled 'METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT
Simplified Explanation
The patent application describes a device and method for producing a semiconductor component. The method involves arranging a dielectric layer between two electrodes of the semiconductor component, which contains defects of a specific type. The process includes determining the time period required for the defects to move into a desired position within the dielectric layer and determining the voltage necessary for this movement. The first voltage is then applied between the electrodes during the specified time period.
- The method involves arranging a dielectric layer between two electrodes of a semiconductor component.
- Defects of a specific type are present in the dielectric layer.
- The time period required for the defects to move into a desired position within the dielectric layer is determined.
- The voltage necessary for the movement of the defects is determined.
- The determined voltage is applied between the electrodes during the specified time period.
Potential Applications
- Manufacturing of semiconductor components
- Improving the performance and reliability of semiconductor devices
Problems Solved
- Addressing defects in the dielectric layer of semiconductor components
- Enhancing the functionality and efficiency of semiconductor devices
Benefits
- Improved quality and reliability of semiconductor components
- Enhanced performance and functionality of semiconductor devices
- Increased efficiency in the manufacturing process
Original Abstract Submitted
A device and method for producing a semiconductor component. The method includes: arranging a dielectric layer between a first electrode and a second electrode of the semiconductor component, there being defects of a first defect type in the dielectric layer; determining a time period for movement of defects of the first defect type into a target position in the dielectric layer; determining a first voltage for the movement of said defects in the dielectric layer; applying the first voltage between the first electrode and the second electrode in the time period.
