18239640. ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING LOCALIZED METAL NANOPARTICLES simplified abstract (Apple Inc.)

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ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING LOCALIZED METAL NANOPARTICLES

Organization Name

Apple Inc.

Inventor(s)

Que Anh S. Nguyen of San Jose CA (US)

Weidi Zhu of Milpitas CA (US)

Andi M. Limarga of Cupertino CA (US)

Nisha S. Sheth of San Mateo CA (US)

ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING LOCALIZED METAL NANOPARTICLES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18239640 titled 'ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING LOCALIZED METAL NANOPARTICLES

Simplified Explanation

The abstract describes a composite enclosure component for an electronic device that includes metallic nanoparticles, non-metallic nanoparticles, or a combination of both, which provide a hue, enhanced mechanical properties, or both.

  • Metallic and non-metallic nanoparticles are used in the composite enclosure component.
  • The nanoparticles enhance the mechanical properties of the enclosure component.
  • The nanoparticles provide a specific hue to the enclosure component.

Potential Applications

The technology could be applied in various electronic devices such as smartphones, laptops, tablets, and other consumer electronics where both aesthetics and durability are important.

Problems Solved

1. Enhances the mechanical properties of the enclosure component. 2. Provides a specific hue to the enclosure component, allowing for customization and aesthetic appeal.

Benefits

1. Improved durability and strength of the enclosure component. 2. Customizable appearance with a specific hue. 3. Potential for increased consumer appeal and market competitiveness.

Potential Commercial Applications

Optimizing Electronic Device Enclosure Components with Metallic and Non-Metallic Nanoparticles

Possible Prior Art

There may be prior art related to the use of nanoparticles in composite materials for electronic device enclosures, but specific examples are not provided in this abstract.

Unanswered Questions

How does the incorporation of metallic and non-metallic nanoparticles affect the overall cost of manufacturing the composite enclosure component?

The abstract does not mention the cost implications of using metallic and non-metallic nanoparticles in the composite enclosure component. This information would be crucial for assessing the economic feasibility of implementing this technology.

Are there any potential environmental impacts associated with the use of metallic and non-metallic nanoparticles in electronic device enclosures?

The abstract does not address any environmental considerations related to the use of nanoparticles in the composite enclosure component. Understanding the environmental impact of this technology is essential for evaluating its sustainability and compliance with regulations.


Original Abstract Submitted

A composite enclosure component for an electronic device is disclosed. The composite enclosure component may include metallic nanoparticles, non-metallic nanoparticles, or a combination of these. The nanoparticles of the composite enclosure component may provide a hue, enhanced mechanical properties, or both.