18239368. Backside Integrated Voltage Regulator For Integrated Circuits simplified abstract (Google LLC)

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Backside Integrated Voltage Regulator For Integrated Circuits

Organization Name

Google LLC

Inventor(s)

Namhoon Kim of San Jose CA (US)

Woon-Seong Kwon of Santa Clara CA (US)

Houle Gan of Santa Clara CA (US)

Yujeong Shim of Cupertino CA (US)

Mikhail Popovich of Danville CA (US)

Teckgyu Kang of Saratoga CA (US)

Backside Integrated Voltage Regulator For Integrated Circuits - A simplified explanation of the abstract

This abstract first appeared for US patent application 18239368 titled 'Backside Integrated Voltage Regulator For Integrated Circuits

Simplified Explanation

The patent application describes a technology related to an integrated circuit (IC) package. The IC package consists of a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die includes a metal layer and a silicon layer, with the metal layer connected to the packaging substrate. The integrated voltage regulator die is positioned next to the silicon layer and connected to the packaging substrate through one or more through mold vias or through dielectric vias. The IC die is specifically an application specific integrated circuit (ASIC) die.

  • The technology is related to an integrated circuit (IC) package.
  • The IC package includes a packaging substrate, an IC die, and an integrated voltage regulator die.
  • The IC die consists of a metal layer and a silicon layer, with the metal layer connected to the packaging substrate.
  • The integrated voltage regulator die is positioned adjacent to the silicon layer and connected to the packaging substrate through through mold vias or through dielectric vias.
  • The IC die is an application specific integrated circuit (ASIC) die.

Potential Applications

The technology described in the patent application has potential applications in various fields, including:

  • Electronics manufacturing industry
  • Semiconductor industry
  • Integrated circuit design and production

Problems Solved

The technology solves several problems in the field of integrated circuit packaging, including:

  • Efficient integration of an integrated voltage regulator die into an IC package
  • Improved connectivity between the IC die and the packaging substrate
  • Enhanced performance and reliability of the IC package

Benefits

The technology offers several benefits, such as:

  • Compact and efficient integration of an integrated voltage regulator die into an IC package
  • Improved power management capabilities within the IC package
  • Enhanced performance and reliability of the overall integrated circuit system


Original Abstract Submitted

The technology relates to an integrated circuit (IC) package. The IC package may include a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die may include a metal layer and a silicon layer. The metal layer may be connected to the packaging substrate. The integrated voltage regulator die may be positioned adjacent to the silicon layer and connected to the packaging substrate via one or more through mold vias or through dielectric vias. The IC die may be an application specific integrated circuit (ASIC) die.

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