18238046. SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS simplified abstract (Microsoft Technology Licensing, LLC)

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Husam Atallah Alissa of Redmond WA (US)

Stephan Wayne Gilges of Seattle WA (US)

Eric C. Peterson of Woodinville WA (US)

Sean Michael James of Olympia WA (US)

Christian L. Belady of Mercer Island WA (US)

Marcus Felipe Fontoura of Medina WA (US)

Ioannis Manousakis of Redmond WA (US)

Bharath Ramakrishnan of Bellevue WA (US)

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18238046 titled 'SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

Simplified Explanation

The abstract describes a thermal management system for cooling electronic devices. The system includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank.

• The immersion cooling system consists of an immersion tank with an immersion chamber, a working fluid, and a condenser.
• The working fluid has a liquid portion that forms an immersion bath in the immersion chamber and a vapor portion that forms a headspace above the immersion bath.
• The condenser condenses the vapor portion of the working fluid back into the liquid portion.
• The vapor buffer tank is connected to the headspace and has a vapor valve that controls the flow of fluid between the vapor buffer tank and the headspace.
• The liquid buffer tank is connected to the immersion chamber and has a liquid valve that controls the flow of fluid between the liquid buffer tank and the immersion chamber.

Potential applications of this technology:

• Cooling electronic devices such as computer servers, data centers, or high-performance computing systems.
• Cooling power electronics in electric vehicles or renewable energy systems.
• Cooling components in aerospace or defense systems.

Problems solved by this technology:

• Efficiently cooling electronic devices that generate a significant amount of heat.
• Managing the temperature of electronic components to prevent overheating and potential damage.
• Reducing the reliance on traditional air cooling methods that may be less effective in certain applications.

Benefits of this technology:

• Improved cooling efficiency and thermal management for electronic devices.
• Enhanced reliability and performance of electronic components by maintaining optimal operating temperatures.
• Potential for compact and space-saving cooling solutions compared to traditional methods.
• Possibility of reducing energy consumption and environmental impact by using more efficient cooling techniques.

Original Abstract Submitted

A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.