18237712. SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
Organization Name
Inventor(s)
Hyoungkook Kim of Suwon-si (KR)
SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237712 titled 'SPIN COATER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
Simplified Explanation
The method involves coating a wafer with a viscous solution and treating it with an acoustic wave.
- Provides a method of manufacturing semiconductor devices.
- Coats at least a portion of a wafer with a viscous solution.
- Treats the coated wafer with an acoustic wave.
- The frequency of the acoustic wave matches the eigenfrequency of the coated wafer.
Potential Applications
- Semiconductor device manufacturing.
- Thin film deposition processes.
Problems Solved
- Uniform coating of viscous solutions on wafers.
- Enhanced treatment of coated wafers using acoustic waves.
Benefits
- Improved efficiency in semiconductor device manufacturing.
- Enhanced control over thin film deposition processes.
Original Abstract Submitted
A method of manufacturing a semiconductor device. The method includes providing a viscous solution to a wafer, spinning the wafer to coat at least a portion of the wafer with the viscous solution, and treating the wafer coated with the viscous solution, by using an acoustic wave, wherein a frequency of the acoustic wave and an eigenfrequency of the wafer coated with the viscous solution are same.
