18233061. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICES

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jingyu Park of Suwon-si (KR)

Jongyoung Park of Suwon-si (KR)

Taeyoung Koh of Suwon-si (KR)

Kiyong Kim of Suwon-si (KR)

Sundoo Kim of Suwon-si (KR)

Jaehyun Kim of Suwon-si (KR)

SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18233061 titled 'SEMICONDUCTOR DEVICES

Simplified Explanation

The semiconductor device described in the patent application includes a first active pattern on a substrate, a first conductive filling pattern, a gate structure, and a bit line structure.

  • The first active pattern extends in a third direction at an acute angle with respect to a first direction and a second direction.
  • The first conductive filling pattern is on the upper surface of the first active pattern and has a parallelogram shape.
  • The gate structure extends in the first direction in the upper portion of the first active pattern.
  • The bit line structure is on the first conductive filling pattern and extends in the second direction.

Potential Applications

  • Semiconductor manufacturing
  • Integrated circuits
  • Memory devices

Problems Solved

  • Efficient use of space on a semiconductor device
  • Improved performance of the device
  • Enhanced functionality of integrated circuits

Benefits

  • Higher density of components on the device
  • Increased speed and efficiency of data processing
  • Enhanced reliability and durability of the semiconductor device


Original Abstract Submitted

A semiconductor device includes a first active pattern on a substrate, the first active pattern extending in a third direction having an acute angle with respect to a first direction and a second direction, the first direction and the second direction being substantially parallel to an upper surface of the substrate and substantially perpendicular to each other, a first conductive filling pattern on an upper surface of a central portion of the first active pattern, the first conductive filling pattern having a shape of a parallelogram, a gate structure extending in the first direction in an upper portion of the first active pattern, and a bit line structure on the first conductive filling pattern and extending in the second direction.