18232617. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yonghwan Kwon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232617 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution structure with multiple layers, a semiconductor chip with a contact pad, vertical connection conductors, a molding portion, and a protective insulating layer.
- The package has a first redistribution layer and a semiconductor chip with a contact pad connected to it.
- Vertical connection conductors are present on the redistribution structure and are connected to the first redistribution layer.
- A molding portion is placed on the redistribution structure, with a second redistribution layer on top of it.
- The second redistribution layer has multiple first pads, each with an alignment hole.
- Second pads are located on the first pads, covering the inner sidewall of the alignment hole.
- A protective insulating layer covers the second redistribution layer, with contact openings exposing the second pads.
Potential applications of this technology:
- Advanced semiconductor packaging for electronic devices
- Improved electrical connections in compact devices
Problems solved by this technology:
- Enhancing the reliability and performance of semiconductor packages
- Facilitating complex electrical connections in a small space
Benefits of this technology:
- Higher efficiency in electronic devices
- Increased durability and longevity of semiconductor packages
Original Abstract Submitted
A semiconductor package includes a redistribution structure including a first redistribution layer, a semiconductor chip on the redistribution structure and having a contact pad electrically connected to the first redistribution layer, a vertical connection conductor on the redistribution structure and electrically connected to the first redistribution layer, a molding portion disposed on the redistribution structure, a second redistribution layer disposed on the molding portion, connected to the vertical connection conductor, and having a plurality of first pads, each of the plurality of first pads having an alignment hole, a plurality of second pads respectively disposed on the plurality of first pads and having a side portion covering an inner sidewall of the alignment hole, the alignment hole having an inner space surrounded by the side portion, and a protective insulating layer covering the second redistribution layer, and having a plurality of contact openings respectively exposing the plurality of second pads.
