18231549. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICES

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jisoo Park of Suwon-si (KR)

Byungju Kang of Suwon-si (KR)

Junghan Lee of Suwon-si (KR)

Jaehyoung Lim of Suwon-si (KR)

SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18231549 titled 'SEMICONDUCTOR DEVICES

Simplified Explanation

The abstract describes a method of manufacturing a semiconductor device involving the formation of an alignment key, a transistor, a contact plug, and a power rail on a substrate.

  • An alignment key is formed through a portion of the substrate.
  • A transistor with a gate structure and a source/drain layer is formed on the substrate.
  • A portion of the substrate is removed to expose the alignment key.
  • A contact plug is formed to be electrically connected to the source/drain layer.
  • A power rail is formed on the substrate to be electrically connected to the contact plug.

Potential Applications

The technology described in this patent application could be applied in the manufacturing of various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.

Problems Solved

This technology solves the problem of accurately aligning different components on a semiconductor device during the manufacturing process, ensuring proper functionality and performance.

Benefits

The benefits of this technology include improved precision in alignment, enhanced electrical connectivity, and overall reliability of the semiconductor device.

Potential Commercial Applications

The technology could find commercial applications in the semiconductor industry for the production of advanced electronic devices with high performance and reliability.

Possible Prior Art

One possible prior art for this technology could be the use of alignment keys in semiconductor manufacturing processes to ensure accurate positioning of components on a substrate.

Unanswered Questions

How does this technology compare to existing methods of alignment in semiconductor device manufacturing?

This article does not provide a direct comparison to existing alignment methods in semiconductor manufacturing, leaving the reader to wonder about the specific advantages of this new approach.

What are the specific dimensions and materials used in the formation of the alignment key, contact plug, and power rail?

The article does not delve into the specific details of the dimensions and materials used in the manufacturing process, leaving room for further exploration and understanding of the technology.


Original Abstract Submitted

In a method of manufacturing a semiconductor device, an alignment key is formed through a portion of a substrate including first and second surfaces opposite to each other, which is adjacent to the second surface of the substrate. A transistor including a gate structure and a source/drain layer is formed on the second surface of the substrate. A portion of the substrate adjacent to the first surface of the substrate is removed to expose the alignment key. A contact plug is formed through a portion of the substrate adjacent to the first surface of the substrate to be electrically connected to the source/drain layer. A power rail is formed on the first surface of the substrate to be electrically connected to the contact plug.